Cea-Leti

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CEA-Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 2,000 talents, a portfolio of 3,200 patents, 11,000 sq. meters of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley, Brussels and Tokyo. CEA-Leti has launched 76 startups and is a member of the Carnot Institutes network. Follow us on www.leti-cea.com and @CEA_Leti. Technological expertise CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products. For more information: www.cea.fr/english @CEA | @CEATech | @CEA-List | @CEA-Liten
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Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips - GlobeNewswire

Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips GlobeNewswire

GaN MicroLED display integrates vision sensor for AI ... - eeNews Europe

GaN MicroLED display integrates vision sensor for AI ... eeNews Europe

CEA-Leti integrates GaN microLED and organic photodetectors into displays - Optics.org

CEA-Leti integrates GaN microLED and organic photodetectors into displays Optics.org

CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough - HPCwire

CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough HPCwire

CEA-Leti develops CMOS-compatible 200mm GaN-on-silicon process close to state-of-the-art GaN/SiC performance - Semiconductor Today

CEA-Leti develops CMOS-compatible 200mm GaN-on-silicon process close to state-of-the-art GaN/SiC performance Semiconductor Today

CEA-Leti's Energy-Harvesting ICs Geared Toward Battery-Free Sensor Systems - Embedded Computing Design

CEA-Leti's Energy-Harvesting ICs Geared Toward Battery-Free Sensor Systems Embedded Computing Design

English Portal - The CEA – a key player in scientific and technological research - cea.fr

English Portal - The CEA – a key player in scientific and technological research cea.fr

CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers - New Electronics

CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers New Electronics

CEA-Leti Highlights Its Path Towards Full Fault-Tolerant Quantum Computing At IEDM - Quantum Zeitgeist

CEA-Leti Highlights Its Path Towards Full Fault-Tolerant Quantum Computing At IEDM Quantum Zeitgeist

CEA-Leti Details Silicon-based Quantum Computing Roadmap - EE Times Europe

CEA-Leti Details Silicon-based Quantum Computing Roadmap EE Times Europe

Applied Materials, CEA-Leti open joint lab ... - eeNews Europe

Applied Materials, CEA-Leti open joint lab ... eeNews Europe

CEA-Leti Demonstrates New Gate-All-Around Nanosheet Fabrication Process - HPCwire

CEA-Leti Demonstrates New Gate-All-Around Nanosheet Fabrication Process HPCwire

Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets - GlobeNewswire

Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets GlobeNewswire

CEA-Leti achieves ‘world records’ in micro-OLED based communications - Optics.org

CEA-Leti achieves ‘world records’ in micro-OLED based communications Optics.org

CEA-Leti stacks 7 levels of silicon channels in GAA transistors ... - eeNews Europe

CEA-Leti stacks 7 levels of silicon channels in GAA transistors ... eeNews Europe

CEA Combines 3D Integration Technologies & Manycore Architectures to Enable High-Performance Processors for Exascale - HPCwire

CEA Combines 3D Integration Technologies & Manycore Architectures to Enable High-Performance Processors for Exascale HPCwire

€55m project to boost sustainable semiconductor manufacturing in Europe - eeNews Europe

€55m project to boost sustainable semiconductor manufacturing in Europe eeNews Europe

CEA-Leti proves RRAM-based TCAMs viable for neuromorphic processors - eeNews Europe

CEA-Leti proves RRAM-based TCAMs viable for neuromorphic processors eeNews Europe

Niobium vias for multi-level superconducting quantum interconnect ... - eeNews Europe

Niobium vias for multi-level superconducting quantum interconnect ... eeNews Europe

AI boost for CMOS image sensors with three layer integration ... - eeNews Europe

AI boost for CMOS image sensors with three layer integration ... eeNews Europe

In-memory neuromorphic AI slashes power consumption to nW ... - eeNews Europe

In-memory neuromorphic AI slashes power consumption to nW ... eeNews Europe

Leti Announces Two New Tools for Improving Transportation Comfort, Safety and Efficiency - Embedded Computing Design

Leti Announces Two New Tools for Improving Transportation Comfort, Safety and Efficiency Embedded Computing Design

All systems go for 7nm FDSOI ... - eeNews Europe

All systems go for 7nm FDSOI ... eeNews Europe

Low power keyword spotting for IoT edge AI ... - eeNews Europe

Low power keyword spotting for IoT edge AI ... eeNews Europe

€3m for hybrid AI chip inspired by insects ... - eeNews Europe

€3m for hybrid AI chip inspired by insects ... eeNews Europe

X-ray diffraction sensor module for airport security ... - eeNews Europe

X-ray diffraction sensor module for airport security ... eeNews Europe

World’s first 3D CMOS on CMOS stacking ... - eeNews Europe

World’s first 3D CMOS on CMOS stacking ... eeNews Europe

Weebit Nano broadens its technology portfolio to further - GlobeNewswire

Weebit Nano broadens its technology portfolio to further GlobeNewswire

First Quantum IC With Quantum Dots and D/A Circuits on a CMOS Chip Presented - Embedded Computing Design

First Quantum IC With Quantum Dots and D/A Circuits on a CMOS Chip Presented Embedded Computing Design

DC-DC converter boosts piezoelectric power ... - eeNews Europe

DC-DC converter boosts piezoelectric power ... eeNews Europe

First hybrid memory technology enables on-chip AI learning and inference - New Electronics

First hybrid memory technology enables on-chip AI learning and inference New Electronics

Leti shows first WVGA microdisplay in GaN, with 10-µm pixel pitch - eeNews Europe

Leti shows first WVGA microdisplay in GaN, with 10-µm pixel pitch eeNews Europe

6G wireless networks could operate in the 140 GHz D-band ... - eeNews Europe

6G wireless networks could operate in the 140 GHz D-band ... eeNews Europe

Multi-bit memory chip stacks on top of CMOS for edge-AI ... - eeNews Europe

Multi-bit memory chip stacks on top of CMOS for edge-AI ... eeNews Europe

Leti pushes 300mm wafer-to-wafer hybrid bonding to 1µm-pitch for 3D ICs - eeNews Europe

Leti pushes 300mm wafer-to-wafer hybrid bonding to 1µm-pitch for 3D ICs eeNews Europe

Solid state battery for wearables is 1mm thick ... - eeNews Europe

Solid state battery for wearables is 1mm thick ... eeNews Europe

A SPICE model for Gate-All-Around transistors ... - eeNews Europe

A SPICE model for Gate-All-Around transistors ... eeNews Europe

Could brain inspired technologies bring data processing and analytics to IoT devices? - New Electronics

Could brain inspired technologies bring data processing and analytics to IoT devices? New Electronics

Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System - PR Newswire

Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System PR Newswire

Microelectronics in space - New Electronics

Microelectronics in space New Electronics

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