Tezzaron Semiconductor

Tezzaron Semiconductor company information, Employees & Contact Information

Tezzaron® Semiconductor Corporation specializes in 3D wafer stacking and TSV processes. The company demonstrated the world's first successful wafer-stacked 3D-ICs back in 2004, including stacked microprocessors, stacked sensors, and stacked SRAM devices. With our DiRAM4 prototype complete, we are turning our attention to foundry and product partnerships that will allow the emergence of a robust ecosystem for all sorts of DisIntegrated 3D™ (Di3D™) products, including memories, FPGAs, ASICs, SOCs and more.
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World’s First Eight-Layer 3D IC Wafer Stack to Contain Active Logic - Electronics360

World’s First Eight-Layer 3D IC Wafer Stack to Contain Active Logic Electronics360

Tezzaron Semi rescues fab critical to DoD - EDN - Voice of the Engineer

Tezzaron Semi rescues fab critical to DoD EDN - Voice of the Engineer

3D IC 2-tier 16PE Multiprocessor with 3D NoC Architecture Based on Tezzaron Technology - Design And Reuse

3D IC 2-tier 16PE Multiprocessor with 3D NoC Architecture Based on Tezzaron Technology Design And Reuse

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