Curt Erickson Email and Phone Number
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Curt Erickson founded IC Interconnect in 1997 as Vice President to establish a contract wafer bumping service dedicated to quality, low cost, quick turnaround and superior customer service. In 2002 he was named President of ICI. To date more than 500 million circuits processed with ICI technology are in service throughout the consumer, telecom, automotive, medical, and space sectors. Prior to joining ICI, Curt spent 15 years with Delco Systems and Delco Electronics in several positions including project engineer, senior mechanical engineer, team leader and staff engineer at facilities in Kokomo, IN, Milwaukee, WI, and Santa Barbara, CA.Curt has traveled extensively in the Americas, Europe and Asia co-developing custom equipment, trouble shooting customer issues, and negotiating agreements.Mr. Erickson has presented papers and chaired technical sessions at electronic industry conferences, delivered project results and funding proposals for the combined armed-services review and scoring, and served as an industry advisor to the ARINC standards committee. He has been awarded patents in the field of wafer bumping and holds a Master’s of Science degree in Materials from the University of Wisconsin-Milwaukee and a Bachelor’s of Science degree in Mechanical Engineering from the University of Wisconsin-Madison.Specialties: Wafer BumpingFlipchip AssemblyElectronic PackagingOperation ManagementProgram ManagementProduct DevelopmentProcess DevelopmentP&LAPQPLean Six SigmaEarned Value Management
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President And CtoIc InterconnectColorado Springs, Co, Us
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President/CtoIc Interconnect Jul 2002 - PresentObjective: In recent years, IC Interconnect has expanded to include back-end wafer processing and the opening of an Asian wafer bumping manufacturing operation. ICI has also diversified to design and manufacture products such as Smart Card Modules and Magnetic Sensors used in residential and industrial settings.Responsibilities:• Increase US service with new eqipment: Automated Visual Wafer Inspection, Laser Mark, Dice and Die Sort• Lean Six Sigma process development and qualification techniques• Establish Asian alliances and manufacturing technology transfer to provide full turn key wafer bumping services with a full suite of bump technologies• Navigate corporate and cultural differences to create a seamless service for our customers• Develop and manufacture electronic products that span flipchip based Smartcard Modules, Magnetic Sensors, and Power conditioners• Drawing sets, bill of material, build instructions and test programs, reliability testing
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Vice PresidentIc Interconnect Nov 1997 - PresentObjective: Establish and manage a contract wafer bumping service dedicated to quality, while maintaining low cost and quick turn-around. Installed state of the art technology into a high volume manufacturing environment with an eye on minimizing cap-x. For the last 11 years ICI has ulitilized electroless Ni UBM (under bump metallurgy) and stencil printed solder paste to provide the foundation of Flipchip and WLCSP (wafer level chip scale package) bare die formats. Responsibilities:• Technology evaluation and selection• Equipment procurement, installation and debug• Process optimization and qualification• Ops staffing and management• Sales and marketing management• Executive sales• Business plan and execution strategy• Profit and loss• Interface with Investment Bankers and Venture Capitalists
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Sr. Project Engineer/Wafer Bumping Development Team LeaderDelco Electronics Jul 1992 - Nov 1997Objective: Technical Manager; DARPA TRP (Technology Reinvestment Project) contract awarded to the “Low-Cost Flip Chip” consortium. Responsibilities: • Project planning • Hardware design • Electronic packaging design • Resource management of multi-million dollar project budgetObjective: Supervisor electronics packaging activities.Responsibilities: • Set direction and manage the Flip Chip Advanced Development group • Budget for, and procure capital equipment • Electroless Ni Process Development • Fine Pitch Wafer Bumping • Redistribtion Process Development • Materials Characterization for Model Development
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Staff EngineerDelco Systems Operations Jan 1983 - Nov 1992Objective: Staff a team capable of developing a new inertial guidance system for an avionics application. Responsibilities:• Team leader responsible for the technical supervision of a multi-disciplined team of designers, engineers, and technicians • Design and build a guidance platform capable of meeting the performance requirements, at cost and on schedule • Represent Delco’s interests at ARINC specification meetings• Write and present the IR&D program to the military services supporting this effort
Curt Erickson Skills
Curt Erickson Education Details
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Materials, Evaporated Ultra-Thin Films
Frequently Asked Questions about Curt Erickson
What company does Curt Erickson work for?
Curt Erickson works for Ic Interconnect
What is Curt Erickson's role at the current company?
Curt Erickson's current role is President and CTO.
What is Curt Erickson's email address?
Curt Erickson's email address is cr****@****hoo.com
What is Curt Erickson's direct phone number?
Curt Erickson's direct phone number is +171953*****
What schools did Curt Erickson attend?
Curt Erickson attended University Of Wisconsin-Milwaukee, University Of Wisconsin-Madison.
What skills is Curt Erickson known for?
Curt Erickson has skills like Ic, Spc, Electronics, Product Development, Semiconductor Industry, Design Of Experiments, Semiconductors, R&d, Manufacturing, Engineering Management.
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