Curt Erickson Email & Phone Number

Colorado Springs, Co, Us

Objective: In recent years, IC Interconnect has expanded to include back-end wafer processing and the opening of an Asian wafer bumping manufacturing operation. ICI has also diversified to design and manufacture products such as Smart Card Modules and Magnetic Sensors used in residential and industrial settings.Responsibilities:• Increase US service with new eqipment: Automated Visual Wafer Inspection, Laser Mark, Dice and Die Sort• Lean Six Sigma process development and qualification techniques• Establish Asian alliances and manufacturing technology transfer to provide full turn key wafer bumping services with a full suite of bump technologies• Navigate corporate and cultural differences to create a seamless service for our customers• Develop and manufacture electronic products that span flipchip based Smartcard Modules, Magnetic Sensors, and Power conditioners• Drawing sets, bill of material, build instructions and test programs, reliability testing

Objective: Establish and manage a contract wafer bumping service dedicated to quality, while maintaining low cost and quick turn-around. Installed state of the art technology into a high volume manufacturing environment with an eye on minimizing cap-x. For the last 11 years ICI has ulitilized electroless Ni UBM (under bump metallurgy) and stencil printed solder paste to provide the foundation of Flipchip and WLCSP (wafer level chip scale package) bare die formats. Responsibilities:• Technology evaluation and selection• Equipment procurement, installation and debug• Process optimization and qualification• Ops staffing and management• Sales and marketing management• Executive sales• Business plan and execution strategy• Profit and loss• Interface with Investment Bankers and Venture Capitalists

Objective: Technical Manager; DARPA TRP (Technology Reinvestment Project) contract awarded to the “Low-Cost Flip Chip” consortium. Responsibilities: • Project planning • Hardware design • Electronic packaging design • Resource management of multi-million dollar project budgetObjective: Supervisor electronics packaging activities.Responsibilities: • Set direction and manage the Flip Chip Advanced Development group • Budget for, and procure capital equipment • Electroless Ni Process Development • Fine Pitch Wafer Bumping • Redistribtion Process Development • Materials Characterization for Model Development

Objective: Staff a team capable of developing a new inertial guidance system for an avionics application. Responsibilities:• Team leader responsible for the technical supervision of a multi-disciplined team of designers, engineers, and technicians • Design and build a guidance platform capable of meeting the performance requirements, at cost and on schedule • Represent Delco’s interests at ARINC specification meetings• Write and present the IR&D program to the military services supporting this effort

Ms-Engineering, Materials, Evaporated Ultra-Thin Films

Bs-Mechanical Engineering, Energy