Scope of Responsibilities- Lead in the creation, implementation and fanning out of the supporting processes and systems.- Integrate the techniques, resource and standards throughout entire project execution - Provide project updates on a consistent basis to various stakeholders progress- Develop and manage a detailed project schedule and work plan- Monitor progress and make adjustments as needed

Scope of Responsibilities- NPI and Specification/ Best known method finalize- In charge of PCN/ MRB/ CIP and action follow up- Safe launch and production validation- The interface of major customerKey Achievement- Monitor the product yield and execute yield improvement plan>>> Found the key improvement product and defined the priority, total 3 products can meet customer yield goal (99.8%) after optimizing the sawing parameter.- PCN for process… Show more Scope of Responsibilities- NPI and Specification/ Best known method finalize- In charge of PCN/ MRB/ CIP and action follow up- Safe launch and production validation- The interface of major customerKey Achievement- Monitor the product yield and execute yield improvement plan>>> Found the key improvement product and defined the priority, total 3 products can meet customer yield goal (99.8%) after optimizing the sawing parameter.- PCN for process weakness and improve quality>>> Through issue the PCN to reduce the process risk of single tooling machine and to meet customer special spec & quality requirement. Show less

Scope of Responsibilities- The representative of Amkor Taiwan for Amkor worldwide WLCSP process project- Major coordinator for continuous improvement project- Yield monitor / improvement & Problem analysisKey Achievement- System enhancement about data collection time reduction in order to improve work efficiency>>> Combined different system/ process/ machine’s record and setting to automatically summary and output process data with plot chart for… Show more Scope of Responsibilities- The representative of Amkor Taiwan for Amkor worldwide WLCSP process project- Major coordinator for continuous improvement project- Yield monitor / improvement & Problem analysisKey Achievement- System enhancement about data collection time reduction in order to improve work efficiency>>> Combined different system/ process/ machine’s record and setting to automatically summary and output process data with plot chart for analysis.- Improve overall backside chipping defect rate from 3100 to 1200 dppm (Reduce ~ 60%)- Improve overall wafer crack rate from 3700 to 1100 dppm (Reduce ~ 70%)>>> Through and full process data and product FA report to identify the root cause and prevent recurring problems for major high yield loss product and drove the cross-functional teams to collaboratively and effectively solve quality issue.Key enhances process: wafer grinding, sawing and PnP Show less