Albert Cheung

Albert Cheung Email and Phone Number

Engineering Leader, EC2 at AWS @ Amazon Web Services (AWS)
Albert Cheung's Location
Seattle, Washington, United States, United States
About Albert Cheung

I'm a passionate Technology Leader with over 16 years of engineering, management, and product development experience which spans architecting highly optimized BSP solutions for mobile & IoT devices, launching immersive computing platforms for AR/VR products, and managing engineering talent in building technologies to evolve the EC2 Networking dataplane at AWS.

Albert Cheung's Current Company Details
Amazon Web Services (AWS)

Amazon Web Services (Aws)

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Engineering Leader, EC2 at AWS
Albert Cheung Work Experience Details
  • Amazon Web Services (Aws)
    Software Development Manager
    Amazon Web Services (Aws) Nov 2022 - Present
    Seattle, Wa, Us
    I am a Software Development Manager at AWS EC2 Networking, where I lead a team of Software Engineers responsible for building software-defined networking (SDN) technologies that power the data plane of EC2 instances. My team designs, develops, tests, optimizes, and deploys platform software that enables virtual networking interfaces and VPC (Virtual Private Cloud) communication.
  • Meta
    Technical Product Lead, Ar/Vr
    Meta Jul 2018 - Oct 2022
    Menlo Park, Ca, Us
    As a Single-threaded Owner (Lead Product TPM), I led the software design, development, and productization of platform software and features powering Meta's AR/VR product portfolio (Meta Portal, Meta Quest). This involved leading a cross-functional team of Software Engineers, Designers, Data Scientists/Data Engineers, and QA on delivering 0->1 products. I owned the product/feature definition, product strategy, planning and execution of software/hardware roadmaps, system design/architecture, security and privacy and defining product and engineering KPIs.
  • Qualcomm
    Sr. Staff Engineer/Manager
    Qualcomm Aug 2014 - Jul 2018
    San Diego, Ca, Us
    Led and managed a talented team of software engineers towards technology incubation, systems integration, automation, and SoC bring-up of modem, audio, and connectivity subsystems of Qualcomm’s wireless chipsets. In 2014, I spear-headed the effort of unifying software development, integration, and testing processes of QCA (Qualcomm Atheros) after Qualcomm's acquisition of Atheros in 2011. - Led and managed a team of engineers towards system software design, development, integration and SoC bring-up for mobile and IoT chipsets. - Drove the architecture, development, and commercialization of a highly power & memory- optimized Core Platform solution for 11ax WLAN and Multi-mode/Multi-function IoT chipsets. - Presented at the QC Architecture Summit to share innovations in debug infrastructure, power optimizations, and frameworks for building high performance, ultra-low memory products. - Designed a novel ROM/RAM patching framework and PCIe demand paging feature, allowing on-chip RAM reduction by over 80%. - Achieved >$4M hardware cost-savings by deploying an “emulation farm” where developers can efficiently time-share emulation resources for development and testing. Developed software product roadmap and code delivery strategies to maximize software leverage and maintenance. Skill set:- Technology leadership across complex, large-scaled projects in wireless SoCs- Proficient in embedded software development in highly memory optimized environments- Experienced in embedded RTOS in ARM processors and DSPs- SoC architecture- Highly knowledgeable through hands-on experience in CPU architecture and real-time operating systems - Excellent critical thinker with sharp debugging skills (debugged and resolved many customer launch-gating issues at customer site) - Highly experienced in platform bring-up (pre-silicon/post-silicon) - Proficient in using JTAG, logic analyzers and Oscilloscopes for debugging complex embedded system system stability issues
  • Qualcomm
    Staff Engineer
    Qualcomm Sep 2011 - Aug 2014
    San Diego, Ca, Us
    • Led a team of engineers (10) towards SoC bring-up, integration, feature delivery, and build & test automation across modem, audio, and connectivity subsystems• Designed and implemented a micro-BSP framework to achieve aggressive Power KPIs• Drove security initiatives and countermeasures (e.g., safeHeap, stackProt, DEP)• Spear-headed the migration from manual to continuous integration and test automation• Managed staffing and resourcing needs to scale from single to multi-tier product families
  • Qualcomm
    Software Engineer
    Qualcomm Sep 2008 - Aug 2011
    San Diego, Ca, Us
    • Led the chipset integration of Bootloaders, micro-kernels, device drivers, and peripherals for the modem and connectivity (WLAN/BT/FM) subsystems• Drove build infrastructure improvements to reduce build times by 5x• Delivered the first ARM9-based integrated WLAN/BT solution on MSM8960 after the acquisition ofAtheros Inc. in 2011 by creating a bare-metal BSP (board support package)

Albert Cheung Education Details

  • University Of Waterloo
    University Of Waterloo
    Mechatronics
  • Albert Campbell
    Albert Campbell

Frequently Asked Questions about Albert Cheung

What company does Albert Cheung work for?

Albert Cheung works for Amazon Web Services (Aws)

What is Albert Cheung's role at the current company?

Albert Cheung's current role is Engineering Leader, EC2 at AWS.

What schools did Albert Cheung attend?

Albert Cheung attended University Of Waterloo, Albert Campbell.

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