Product Owner/Team LeadFPGA test debug and optimization, specifically tile portion in packaged device/wafer levelTTR, Yield improvement, manufacturing ramp up

Worked on test migration from legacy site to test partners. ATE platform used are Magnum & J8002020 - part of team releasing multiple devices for XQFN and TSSOP packages.2021 - part of team verifying new method of test program generation (test manager method). 2022 - worked on qual and validation test programs. Characterize ATE to ACSam specifically for propogation delay parameter

Work on qualifying new fabrication/assembly and test sites for high runner products.

New product development and qualification for mainly analog devices. Perform device characterization across temperature and ensure excellent test coverage for customer applications. Highlights:— Qualify new device spin and ensure datasheet spec compliance for high reliability product lines. Product qualification mainly for extreme temperature usage (up to 150C for plastic packages, 210C for ceramic packages)— Worked on various analog devices from different product groups as well as some logic and digital devices (mosfet driver, buck-boost converter, step down converter, amplifiers, MSP430 microcontroller, buffer, BUS switch) — Data analysis using mainly CPK method. Tools used includes custom excel macro, mbayse (TI-owned data analysis tool). Experience in using various ATE (ETS364, J750, ultraFlex, IntregraFlex, microflex). Went through ETS364 and ultraFlex training courses.— Test program certifier for Eagle tester platform. Responsibilities includes auditing test program checklist, test program limits and supporting documents before the test program can be used in the manufacturing site. Qualify new probe solution based on exisiting final test solution for tested die/ known good die market.

Worked on sustaining and ensuring production cycle time. Worked on continuous improvement in quick turnovers and reduce hold lots. Setup and train new technicians on hold lot handling process. Qualify new equipment based on statistical data and distributions. Worked with FAB to improve production yield. Highlights:— Yield sustaining and improvements by working together with wafer fabrication sites for process improvement— Qualify new equipment transferred from different production sites. Involved in the transfer project of probe area from Phoenix to Senawang plant. Responsibility to qualify — Qualify new tester platform delivered from vendor (Maverick tester platform).— Train and qualify new technicians for “on-line lot verification”. This new process allows faster disposition during night shifts and holidays. Responsibility includes creating syllabus which allows the technician to perform the required task. Test questions created from the syllabus to allow — New test program creation and qualification. It was a project to qualify new tester platform in probe area to test logic device. The problematic device was an unprobed device and having high yield loss at final test area. By qualifying the device at probe, it will avoid the yield loss as only good units will be used at assembly stage.