Abdul Jalil Email and Phone Number

• Develop LED product from design stage to mass production and product qualification.• Project Leader for high/mid complex product projects .Lead function teams from various department (both Penang and Germany) in planning, execution and reviews to meet project targets considering project deliverable, timeline, quality, customer requirements and cost.• Perform project/product risk assessment with working team and take the require actions to minimize project/ product risk that can… Show more • Develop LED product from design stage to mass production and product qualification.• Project Leader for high/mid complex product projects .Lead function teams from various department (both Penang and Germany) in planning, execution and reviews to meet project targets considering project deliverable, timeline, quality, customer requirements and cost.• Perform project/product risk assessment with working team and take the require actions to minimize project/ product risk that can impacting project budget, timeline and quality target.• Integrate with Sales & Marketing to identifying the needs and goals for a new product, as well evaluate market needs, existing competition and potential costs. • Establish product road map to identify continuous improvement target.• Work with new material suppliers during product qualification to select right materials that can meet product requirement. Show less

• Program Manager for WLCSP new products for Apple (Iphone Watch) & Samsung Galaxy and delivery project successfully with regard to quality,yield and cost.• Liaise with customer on new product qualification and requirement from design stage, prototype until product completion.• Prepare and select indirect material(carrier tape, cover tape & plastic reel) for new product qualification, • Qualify carrier tape based on EIA spec for Ao,Bo, and Ko and cover tape including peel force… Show more • Program Manager for WLCSP new products for Apple (Iphone Watch) & Samsung Galaxy and delivery project successfully with regard to quality,yield and cost.• Liaise with customer on new product qualification and requirement from design stage, prototype until product completion.• Prepare and select indirect material(carrier tape, cover tape & plastic reel) for new product qualification, • Qualify carrier tape based on EIA spec for Ao,Bo, and Ko and cover tape including peel force strength result.• Prepare & Submit FAI report for new indirect material which includes Dimension results, Test Report, MSDS, Part Drawing and CoC.• Qualify new recipe for Die Sorting (tape and reel) machine based on optimal product requirement subject to yield, cycle time and cost.• Learn and teach vision system parameters (light intensity) for new product on accept/reject criteria.• Anticipate issue for WLCSP process by applying preventive approach and method, example SPC, machine setup and FMEA.• Apply DOE and cpk analysis for process optimization and yield improvement. • Improve machine downtime and train the technicians for MTBA and providing OPL for MTTR.• Main auditor for WLCSP process area. Show less

Area of Work: Incoming Wafer Inspection (IWI), Wafer Mounting Process,UV Cure and Pick & Place.• • Received AMD Achievement Award presented by Deputy Prime Minister YAB Tan Sri Dato’ Haji Muhyiddin Yassin on Sat 16 June, 2012• Attend course on Maximizing Equipment Efficiency by Proactive Maintenance.Improve Proactive Maintenance at Die Prep area by applying E10 RAM (Reliability, Availability and Maintainability) and OEE E79(Overall Equipment Effectiveness)Improvement in… Show more Area of Work: Incoming Wafer Inspection (IWI), Wafer Mounting Process,UV Cure and Pick & Place.• • Received AMD Achievement Award presented by Deputy Prime Minister YAB Tan Sri Dato’ Haji Muhyiddin Yassin on Sat 16 June, 2012• Attend course on Maximizing Equipment Efficiency by Proactive Maintenance.Improve Proactive Maintenance at Die Prep area by applying E10 RAM (Reliability, Availability and Maintainability) and OEE E79(Overall Equipment Effectiveness)Improvement in machine availability by improving PM method/methodology & MTBF.Develop and qualify critical process parameters based on DOE (Design of Experiment).• Six-Sigma Green BeltReduce jagged defect and die chip by introducing UV tape for die saw processImprove die saw cycle time during UV tape introductionCreate and qualify re-mounting recipe for wafer skip sawing for UV tape.• Attend the FMEA (Failure Mode Effects Analysis) training.Apply FMEA method on new product/process qualifying.Apply FMEA method on new equipment buyoff and qualification.• Attend QCC TrainingLead QCC (Quality Creative Circle) Project on Bump Damaged Reduction at Die Preparation Area• 1st Prize AMD Penang Team Symposium 2011UV Tape Implementation and Improvement• 1st Prize AMD Penang Poka Yoke 2011Hard Block to prevent Coolant bar drop during sawing process• Lean Manufacturing & Train The Trainer 2009Reduce cycle time at die prep for UV tape 2011Improve UPH for Pick & Place Machine for new product introduction.• Establish and Setup Incoming Wafer Inspection Criteria, procedure and disposition.• Ability to setup, operate and troubleshoot Waftech wafer inspection, Longhill Mounter, Lintec UV cure,Datacon Evo Pick & Place,Reflow Heller machines and Universal Bin Sorter.• Attended the course on Domestic Inquiry Procedures, which bring title of Inquiry Officer. Show less

• Ensure proper and efficient operations and plan, implement, communicate and lead a team of production group. • Enhance cost controls and productivity by minimizing down time, wastage, overtime.• Oversee discipline, housekeeping and safety practices • Interviewer for operator hiring.• Generate production performance report• Drive/execute volume ramp schedule• Supporting Lean Manufacturing, OEE and Total Preventive Maintenance (TPM) activities.