Abdullah Ansari Email & Phone Number

India

India

Gandhinagar, Gujarat, India

o Featured high density, with routing a hybrid of high-speed digital and analog signals, analog and digital ground planes.o Designed the layouts of high density analog and digital boards while adhering to high speed standards using cadence Allegro 16.6.o Utilized schematic enter to layout, for placement and routing of RF, HDI, digital, and analogdesigns. o Printed Circuit Board design of Video and Audio Cards including via on pad/route of high density BGA/LGA patterns. o PCB design of Multilayer Board up to 20 Layers. o Board Layout with BGA-1156 pin package as well as 1mm ball pitch. o Layout design with 6 BGA packages in one board. 1 BGA packages having 1156 balls, 4nos. of DDR4 having 96 balls and one eMMc device. More than 1700 connections are in a single board. o PCB layout of extremely dense hi-speed designs with clock speeds to 100 Megahertz to 2.4 Gigahertz. o Designed layout having FPGA, DDR4, eMMC Flash Drive, USB 2.0, DDR4 SO-DIMM, ETHERNET, Audio CODEC, HDMI and SD card. o Read and interpreted schematics, system functionality, and performance specifications according to the design guidelines.o Engaged with external customers for design requirements, developments, and resolutions for design changes. o Maintained constant communication with our manufacturing suppliers to implement the required changes needed to produce high yield printed circuit boards. o Executed complete design layout per Engineer's design constraints and company guidelines and all incorporating datasheet standards. o Interfaced with customers at various levels, including engineering design, fabrication, and assembly.o Knowledge of Blind, Buried, plated through hole (PTH) vias. o Knowledge of Signal Integrity (SI) and Power Integrity (PI). o Create Library parts per IPC standards or manufacturing capabilities using CADENCE/ALLEGRO. o Interfaced with PCB customers to ensure implementation of CAD DFM and DFT standards.

Ahmedabad, Gujarat, India

Proficient with PCB layout design in OrCAD, Allegro and CADSTAR. o Hands on knowledge with schematic capture in OrCAD and CADSTAR. o Well versed with Digital Design, Analog Design, Mix Signal and RFLayout. o Good knowledge of High speed design with Multi-layer and high density PCB layout boards. o Familiar with Surface mount as well as Through Hole PCBs. o PCB design of Multilayer Board up to 12 Layers. o Board Layout with BGA-676 package as well as 1mm ball pitch.o Layout with 3 BGA packages in one board. 1 BGA packages were of 676 balls and the other two of 96 balls. More than 1500 connections are in board. o Designed layout having FPGA, DDR3, ADC, USB 2.0, HDMI, Bluetooth and GPS. o Designed board with variable control impedances like single ended 50 ohm and differentials 90 ohm, 100 ohm. o Understanding of length matching routing. o Knowledge of interfaces like SPI, UART, I2C, HART, Ethernet, USB2.0.o Knowledge of differential pair, Shielding and Auto routing.o Knowledge of Flight module PCB Layout and fabrication process (as per SAC/ISRO guidelines). o Making a Schematic Symbol and PCB footprint from the data sheet. o PCB integrated library and also in the database. o Designed flight module Layout for NISAR, GSAT-29, IRNSS, AIS, GSAT-11, GSAT-20, GSAT-31, RISAT, NAVIC, ADITYA-L1 and GAGANYAAN projects. o Manages the releases of Gerber data & BOM's (bill of material) file for production of PCB board manufacturer. o Generating the following files:- oGerber data cross check in UCAMX. oODB++ file and cross check generated data. o DXF file and cross check with mechanical team. o PCB analysis using CAM (UCAMX) software with very dense and high power cards up to 24 layers Board. o Knowledge of making penalization, drilling and routing files in UCAMX. o Ease of handling by making Layer structure (Stack up)

Bachelor Of Engineering - Be, Electronics And Communications

Diploma, Electronics And Communications