Achint J. Email & Phone Number

Fremont, California, United States

Sunnyvale, California, United States

- Collaborated with a team of 8 people to create an automated sterilizing station to replace manual human labor by using a Universal Robot UR10e to sanitize Q-tips and syringes- Coded a GUI user interface using C# for employees to control, interact, and debug with the UR10e Robot to adjust internal robot settings and improve output efficiency in sterilizing Q-tips and syringes- Assisted with the design creation of the Q-Tip and Syringe stations by assisting with CAD designs and helping with the sensor debugging and testing

Santa Clara County, California, United States

• Collaborated with mentors and acquired knowledge on how to use CREO to create CAD models that were able to assist with failure testing for AI server connections• Automated and assembled a lift mechanism that can carry heavy fabric cards around the headquarters without requiring human labor, reducing the number of injuries caused by heavy lifting•Tested and experimented with different springs with spring force testing to assist employees in detaching/attaching new server racks• Assisted with wind tunnel testing to compare different types of fans to help reduce heating in AI servers

Fremont, California, United States

• Worked with Mechanical Engineering and Reliability teams to support manufacturing and development of Compute and AI servers for use in hyper-scale digital Infrastructure. • Supported development of new cooling methods and heat dissipation mechanisms using my knowledge of fluid dynamics that led to >4% savings in energy consumption for re-designed racks• Supported the CFD computations and conducted failure analysis for thermal and reliability tests using my knowledge of mechanical engineering and fluid dynamics• Worked with the ME/manufacturing team to help troubleshoot and diagnose hardware field failures and customer samples. Troubleshot and successfully analyzed 11 customer cases.

Fremont, California, United States

• Developed understanding of the process of assembling and testing manufacturing components for electronic packaging.• Practiced stress and thermal analysis via SOLIDWORKS.