- Molding Process Engineer for EV Power Integration Module department. - Develop and enhance molding processes to achieve production targets and quality requirements.- Perform mold validations, process validations, and root cause analysis on molding-related challenges.- Implement and manage process documentation such as standard operating procedures (SOPs), work instructions, control plan, and PFMEA.

- Die Attach Process Engineer for CIS iBGA department.- Involved directly with the Die Attach / Die Bond process, which uses epoxy dispensing as the fundamental process.- Supported manufacturing line with process engineering, ensuring quality, yield, cost, and cycle time.- Utilize statistical methods and data analysis tools such as statistical process control (SPC) to monitor process capability and drive continuous improvement efforts.

• Experienced in Besi Datacon 2200 evo, ASM IS868LA2 Bonders and ASM MCM12 Die Bonding machine to optimize machine performance, capability and quality.• Responsible for sustaining and improving the Die Attach process to ensure robust process and manufacturability.• Identified root causes of an event by using analysis tools such as 5 Whys Analysis, 8D Problem Solving and Fishbone Diagram and develop corrective actions and preventive measures for more effective problem-solving.

• Designed and developed a new product by using 3D CAD software such as Inventor and AutoCAD with accurate details. • Developed the manufacturing process of assigned projects such as fabricating and assembling.• Performed failure analysis on customer returned products, identified the root cause for failures and provides effective corrective actions.