As a Mechanical Engineer, I strategically boost process efficiency, design cutting-edge products, manage projects end to end, and nurture business relationships with suppliers and manufacturing partners. Throughout my career, I have leveraged this approach to deliver innovative solutions across multiple market segments including data centers, client computing, graphics hardware, electromechanical and optoelectronic connectivity devices and many other Silicon based technologies. Some areas of my expertise include Mechanical Design (CAD, GD&T), Structural & Thermal Simulation (FEA, CFD), Machining and Assembly services (CNC, Sheet metal, Molding etc.), Data Analysis and documentation. I have acquired multidisciplinary engineering knowledge through a blend of cross functional trainings and interactions with multidisciplinary teams across electrical, mechanical, optical and software domains. Some of the more recent areas I’m expanding into include electronic design, PCBA mechanical design and Python for data science. I specialize in technologies aimed at providing the infrastructure for enabling and sustaining connectivity for Data Centers, Machine learning & Artificial Intelligence equipment and cloud computing networks. Some of my accomplishments include:♛ NEW TECHNOLOGY CONCEPT DEVELOPMENT: Received award for delivering state-of-the-art, low-component, 100GB product based on silicon photonics at 33% of the market price to trillion-dollar companies within tight deadlines. ♛ COST REDUCTION: Reduced laser-chip packaging costs dramatically by increasing reliability to 20 years; designed compact housing with electronical, mechanical, thermal, and optical stability.♛ HIGH-VOLUME MANUFACTURING: Increased output of die-sorting process to 5000 from 300/hour by generating buy-in from higher management to invest in process automation while ensuring that suppliers met predefined quality criteria. ♛ Key Skills: Packaging Design, Process Design, High-Volume Production, Data Analysis, Root-Cause Analysis & Issue Resolution, Training & Development, Continuous Improvement, 3-D Modeling, AutoCAD, MATLAB, Lithography, Design-of-Experiments (DOE)