Expertise in Reliability Engineering and Electro-mechanical assemblies: Electronic Device Failure Analysis, Design Validation, Environmental Stress Testing (Highly Accelerated Life Test (HALT), Mechanical Shock/Vibration, Temperature and Humidity with electrical Bias (THB), Temperature Cycling, Thermal Shock, High Temperature Operating Life (HTOL), Fine/Gross Leak, Electro-Static Discharge (ESD), Electro-Magnetic Interference (EMI), more), Risk Analysis and Control (Failure Mode and Effects Analysis (FMEA), Fault Tree Analysis (FTA), Cause-Effect mapping, Root Cause Analysis (RCA), Design for Reliability (DfR) approaches, Physics of Failure (PoF) modeling, Failure Reporting And Corrective Action Systems (FRACAS), Corrective And Preventive Actions (CAPA), more), Lean and Six Sigma methodologies (Process Mapping, Statistical Process Control (SPC), Gage Repeatability and Reproducability (Gage R&R) , Project Management, more), Statistics (Weibull Analysis, Normality Tests, Analysis of Variation (ANOVA), more), Non-destruction and destructive analyses, Reverse Engineering, Quality and Environmental Management Systems (ISO9000, ISO14000), Analog and Digital circuit analysis (specific experience with DC/DC, power conversion, A/D and DAC), Life and Warranty Predictions, Military and other Hi-Rel processing, Design of Experiments (DOE), Printed Circuit Board (PCB) construction and analyses, Software (Minitab, Weibull++, RELEX, Microsoft (Word, Excel, Project, Powerpoint), more), Process and Compliance Audits, Lab Management, more. Exceptionally detail-oriented with years of both theoretical and hands-on experience. Very ambitious (mostly self-taught) and highly motivated to learn and DO more.