Ajith Adhur Kutty Email & Phone Number

Oulu Area, Finland

- Specification of HW modules and design of SW modules for mmW RF circuits and Analog Beamforming control in 5G FR2 wireless modems for handheld devices, across a few generations of 5G FR2 chipset development.- Developed behavior models for HW systems to aid circuit development, and created software drivers for specified HW modules.- Collaborating with cross-functional teams (PHY Layer SW engineers, Algorithm designers, RF System/circuit designers, Baseband circuit designers) to realize optimum solutions against system requirements and design constraints.- Estimated dimensions for various hardware modules, and control traffic across interfaces to determine control bandwidth requirements.- Designed, developed, and debugged software modules for multi-core microprocessor subsystems and digital signal processors.- Implemented low-power control solutions while meeting system hard real-time requirements.- Initially contributed to device driver development for RF circuits in a cycle-constrained, power-efficient NBIoT module.

Tampere Area, Finland

- Research on inkjet printed UHF RFID (Radio Frequency Identification) based passive wireless sensors for smart and intelligent environments.

Tampere, Finland

- Research on inkjet printed UHF RFID (Radio Frequency Identification) based passive wireless sensors for smart and intelligent environments.- Comparative studies on inkjet and thermal printing of UHF RFID tags.

Tampere, Finland

Bengaluru Area, India

RF SW and RFIC FW development for 2G, 3G and LTE modem platforms.- Team lead for a team of five, with ownership of firmware in Broadcom / Renesas 2nd generation RFIC. - Providing solution for issues from performance testing, field testing internally and by the customer.- Providing new feature support for the productization of different mobile phone models being made by the customer.- Leading development of TD-LTE feature support in RFIC firmware on 3rd generation RFIC's.

Oulu, Finland

- Part of Rx team in RF HW platform team developing RF HW subsystem in a triple mode (2G/3G/LTE) mobile platform.- Impedance matching of RF front end components like switches and duplexers with RFIC.- RF performance testing, debugging and providing HW/SW solutions for improvements towards productization of the modem platform.- Debugging and resolving HW/SW issues related to DigRF interface (MIPI).

Bengaluru Area, India

- RF device driver SW development primarily for 2G, but also for 3G \& LTE, on two generations of Renesas triple mode RFICs.- Design of RF production tuning SW architecture for Renesas mobile platforms, including internal SW interfaces and message based interface between mobile device and tester machine.- Onsite support at customer's factory resolving RF SW issues and making improvements to improve the production yield of the handsets.

Working on Layer 1 DSP software for GSM/GPRS mobile phones as part of DSP RF team.- Design and implementation of a common RF HAL for 2G, 3G and LTE modem SW contributing towards Nokia's modem out-licensing business.- Pre-silicon wakeup and first call on licensee chipset with Nokia modem at licensee locations for different licensees.- Ownership, development and maintenance of API's needed by RF HAL to use L1 SW services towards production tuning purposes.- Development of faster calibration methods (Nokia tuning methods) for Nokia products using 3rd party chipsets (Broadcom, Infineon). Ownership and maintenance of the required SW interfaces for production tuning of all 3rd party chipsets. - Ownership of all RF SW issues and implementation of new features on an RF platform (RFMD's RFIC) used in Nokia phones.

- Layer 1 Modem DSP firmware development for TETRA Radio.- Redesigned control and algorithm of modem firmware for the receiver including modifications to symbol gathering, timing recovery, DC offset removal, AGC etc.- Designed and implemented new power saving strategies.- Drafting and documentation of the redesign proposal and leading a team of 3 members during the re-design.- Supported IOP testing and certification and solving on-field issues at customer locations in Asia.

- Implementation of several functions of AMR-WB decoder in assembly language for QDSP4 DSP.- Modification of vocoder bios and audio decoder bios for application DSP firmware in Qualcomm’s modem chipset SC1x.

TETRA L1 Algorithm-Control-BB-RF Software development.-Porting assembly code from TMS320C54x to TMS320C55x TI DSP-Modification of SW control, algorithms etc to port the modem design to new HW architecture.-Device drivers for Baseband ICs, RF ICs, DSP/ARM peripherals like McBSP, DMA etc in Omap5910 dual core processor.

Master Of Science (M.Sc.) (Technology), Wireless Communications, 4.68/5.00

Antennas, Transmission Lines and Waveguides, Passive and Active RF Circuits Nanometer Devices, Circuits and Models Integrated Circuits CAD.

Bachelor Of Technology (B.Tech.), Electronics & Communication Engineering, 77.6/100

Activities and Societies: National Service Scheme (NSS)Communication Engineering Digital Communications Digital Signal Processing.