Alan Derevensky Email & Phone Number

As a Systems Engineer at Universal Instruments Corporation (UIC), a leading provider of electronics assembly solutions, I coordinate with a vast team of engineers to develope new features through systems testing for our High Speed Wafer Feeder (HSWF). The HSWF provides assembly lines the capability of handling silicon wafers of multiple sizes in conjunction with surface mount technology. I joined UIC in Sep 2023, after completing my MS in Mechanical Engineering from Binghamton University where I developed a fundamental understanding of dynamic systems and transport phenomena. During my studies I contributed to electronics packaging projects that utilized heat transfer and CFD simulation, lattice formation in nTop, Python programming, nanofabrication techniques, and computer systems integration. I have also earned multiple certifications in engineering ethics, SimScale CAE, and platform programming with DPO. I am passionate about thermal management, fluidics, and additive manufacturing, and I enjoy learning new skills and technologies in these domains.For fun, I enjoy building computers, restoring guitars with floyd rose bridges, and going to the gym. I look forward to networking with you and exchanging ideas on the latest engineering advancements.