Manage HP PS semiconductor IC procurement Team, focus on Power IC and Signal Integrity IC.

Focus on engineering and quality of semiconductor e2e supply value chain in HP Strategic IC Procurement Org. Partnering with internal stakeholders and external semiconductor suppliers to drive long-term strategic success of AI PC.

Responsibilities- Scope: NB, Desktop, AIO, Workstation, Monitor, and RPOS- Development of service and support contract for product RFQ’s - Administration of T’s and C’s in service and support contract for full support life of product- Responsible for ODM price file validation for spare parts- Continuous supply of spare parts at the lowest cost- Drive ODM delivery performance improvement in providing best in class spare parts availability - Manage HP Service and Support High Performance Supplier Scorecard - Global service strategy developmentMajor Achievements:- Attained WW record low backlog rate - Established WW service contracts and models for NB, DT, and Displays- Led T’s & C’s negotiation and implementation- Transformed WW RMA processes- Expanded price file validation and cost optimization for ODM and OEM parts- Upgraded WW service scorecard integration- Operated WW cost reduction programs

Responsibilities:- WW ODM quality management (Commercial + Consumer)- NPI quality and customer Experience readiness- Monthly quality and service review meeting- Quality management for HP DTO products (Commercial + Consumer)- Project management for APJ specified quality improvement- Regional QPM for APJMajor Achievements- 28% non-HW issues improvement in APJ Consumer Business- 63% total failure reduction in growth countries, China and India- First quality incentive of China products

Responsibilities:- Commodity management (8 suppliers), $30M business per year- People management (5 direct reports)- New process/product implementation, machine buy-off and mass production.- Lead-time, quality & yield improvement in TI Taiwan and material suppliers- New Package and Material developments with TI worldwide team and suppliers- Leader of TI worldwide substrate & lead-frame commodity groups- Program manager of TITL OM cost reduction programs with TI W/W procurement groups- Program manager of TI worldwide enterprise qualification & reliability testing- Global sourcing, benchmarking, and supplier selectionMajor Achievements:- Cost1. Achieved commodity cost saving: 10% every year2. Increased low cost souring growth (from 25% to 70% within one year)3. Collaborated W/W teams to execute cost reduction programs- Quality1. Established & drove measurable quality metrics / goals2. Conducted quality & system audits for critical suppliers per TS169493. Resolved Automotive customers’ complaints4. Managed substrate yield improvement (from 60% to 90%) in half year- Technology1. Implemented new product, material and technology developments2. Originated new TI W/W specifications3. Supervised on-site technical assessments with TI W/W teams- Qualification1. Pioneered 2nd source developments to meet business growth2. Qualified new plating line / new plant / site move3. Strengthened new supplier engagements and qualifications4. Led team to pass ISO/TS 16949 external audits