Alan Estep Email & Phone Number

Chapel Hill, NC, US

Nashua, New Hampshire, US

Atlanta, GA, US

Supported daily production and the resolution of internal quality issues, ensuring products met regulatory and workmanship standards.Addressed internal and customer complaints thru CAPA and NCRs utilizing 8D and Root Cause AnalysisCreated / improved quality documents and inspection procedures, addressed internal and customer complaints thru CAPA and.

Neuilly Plaisance, FR

Facility shut-down in December, 2019. Led New Product activities associated with company’s e-cigarette fulfillment facility, including reviewing customer BOM structure, loading structure into company’s MRP system (MAX), establishing internal work instructions, and coordinating customer qualifications and ECN activities. Implemented TPM (Total Productive.

Durham, NC, US

Led activities associated with maintaining the SMT manufacturing Universal line running specific thermal electric modules and heat pump cartridges for production; tracking product flow and lot travelers using CAMSTAR MES system; assisting with development for freezer applications to include fixture and tooling development; and working to assist with.

Neuilly Plaisance, FR

Customer-focused Manufacturing Engineering responsibilities involve reviewing customer documentation and providing DFM review and BOM analysis; maintaining customer AML/AVL through MAX MRP System; developing SMT placement programs and necessary tooling (stencils, press-fit plates, wave pallets) based off customer-provided gerber data; writing internal.

US

Developed and managed all New Product Introduction (NPI) activities for start-up electronics contract manufacturer from kitting, component prep, SMT/TH assembly, manual assembly, test, inspection against workmanship standards, and final packaging. Focused on managing the conversion of customer design data to manufacturing data, programming and tooling..

Worked as process and manufacturing engineer for entire circuit board assembly flow. Promoted to New Products Introduction (NPI) Engineer, handling all first-time runs and coordinating conversion of such assemblies to production level. Promoted to NPI Manager in charge of NPI Assembly, Product Engineering, Document Control, and Engineering Control.

Trained two years as an IC Package Designer in Mitsubishi Electric’s semiconductor headquarters in Kita-Itami, Japan. Upon return to USA, assigned to develop and support surface mount assembly program. Responsible for specification and evaluation of direct and indirect materials; development of workmanship standards; design of screen printing stencils and.