Supported daily production and the resolution of internal quality issues, ensuring products met regulatory and workmanship standards.Addressed internal and customer complaints thru CAPA and NCRs utilizing 8D and Root Cause AnalysisCreated / improved quality documents and inspection procedures, addressed internal and customer complaints thru CAPA and NCRs.Created quality/KPI reportsReviewed and approved all engineering work instructions and performed FAIR (First Article Inspection Reports) for all new product. Providing engineering support to PCBA operation to include stencil design, SMT programming, and DFM for new productsPerformed Level 3 PPAPs when requested to included FMEA, Control Plan, and MSA

Facility shut-down in December, 2019. Led New Product activities associated with company’s e-cigarette fulfillment facility, including reviewing customer BOM structure, loading structure into company’s MRP system (MAX), establishing internal work instructions, and coordinating customer qualifications and ECN activities. Implemented TPM (Total Productive Maintenance) program while coordinating installation of CMMS Program (eMaint), revamping spare parts inventory system, and creating a more robust and consistent preventive maintenance program. Performed internal audits to ISO 9001-2015 standard and in preparation for FDA ISO 13485 certification.

Led activities associated with maintaining the SMT manufacturing Universal line running specific thermal electric modules and heat pump cartridges for production; tracking product flow and lot travelers using CAMSTAR MES system; assisting with development for freezer applications to include fixture and tooling development; and working to assist with improving yield, cycle time, and process development of the heat pump assemblies. Employment ended due to company’s customer engagement changes.

Customer-focused Manufacturing Engineering responsibilities involve reviewing customer documentation and providing DFM review and BOM analysis; maintaining customer AML/AVL through MAX MRP System; developing SMT placement programs and necessary tooling (stencils, press-fit plates, wave pallets) based off customer-provided gerber data; writing internal assembly instructions using Aegis software; ensuring that product complies with appropriate workmanship standards (IPC-A-610E, Class 2 and 3); acting as primary technical point-of-contact with customer; providing rework instructions for RMA/Refurbishment requirements; and working with process engineering to establish efficient and lean manufacturing techniques for customer product. Serve as internal auditor for ISO-9001 and AS9100 compliance, Customer technologies include commercial, aerospace, medical and industrial.

Developed and managed all New Product Introduction (NPI) activities for start-up electronics contract manufacturer from kitting, component prep, SMT/TH assembly, manual assembly, test, inspection against workmanship standards, and final packaging. Focused on managing the conversion of customer design data to manufacturing data, programming and tooling. Responsible for all stencil designs as well as all pick-n-place programs for Panasonic Panasert equipment using Panasonic PanaPro platform and later Universal GSM equipment using Universal DPO platform software. Offered DFM services to customer designers and acted as primary resource and liaison with printed circuit board fabricators. Established document control procedures, managed internal intranet, developed external website and led team to establish ISO-9001:2000 certification within first 18 months of company existence.

Worked as process and manufacturing engineer for entire circuit board assembly flow. Promoted to New Products Introduction (NPI) Engineer, handling all first-time runs and coordinating conversion of such assemblies to production level. Promoted to NPI Manager in charge of NPI Assembly, Product Engineering, Document Control, and Engineering Control Management.

Trained two years as an IC Package Designer in Mitsubishi Electric’s semiconductor headquarters in Kita-Itami, Japan. Upon return to USA, assigned to develop and support surface mount assembly program. Responsible for specification and evaluation of direct and indirect materials; development of workmanship standards; design of screen printing stencils and machine fixtures necessary for customized assemblies; and implementation of manual assembly/rework techniques. Prepared process documentation and operator certification program to comply with ISO-9002 registration. Trained operators on SPC to aid in daily production monitoring. Facilitated Small Group Activity team aimed at daily yield improvement programs and higher productivity.