Alan Townsend Email & Phone Number

Neenah, WI, US

Neenah, WI, US

Leading cross-functional product design teams.

Plano, Texas, US

• Evolved ATCA “GENiUS” platform into a market differentiating, single rack, fully integrated delivery vehicle for 3 key GENBAND applications – VoIP Call Server, SIP Application Server and Session Border Controller.
• Prioritized R&D effort of 50+ engineers and architects over 3 years to enable a $1B+ market opportunity in Class 4 & Class 5 Network Transformation for Tier 1 Service Providers globally.
• Positioned product in customer RFPs, major customer presentations, custom configuration quoting and Sales support which has returned revenue of $16.5M so far, plus deployment of 10 trial systems to enable future.
• Led key feature enhancements to Linux-based HA middleware including Virtualization, GEO redundancy, and Application Co-residency (Requirements definition, Configuration/Cost impact analysis, Marketing collateral).
• Provided business oversight (incl. product forecasts, commercial terms comparisons, etc) for a 14 supplier, open RFQ to introduce an evolved 40G ATCA chassis, Dual Intel SandyBridge ATCA blade and Dual SandyBridge.
• Above enhancements yielded a 50% power reduction, 70% floor space savings, 6 week delivery interval reduction and a 48% product cost reduction.

CA

• Introduced, sustained and cost reduced ATCA hardware, integrated equipment frames and high-availability middleware on “Versatile Services Engine” platform for four key Wireless Applications (MSC, EVDO RNC, HLR and LTE.
• Deployed 70+ “Versatile Services Engine” platforms around the globe, including the #2 wireless service provider in Japan and the #1 and #2 wireless service provider in N. America.
• Drove $6M of annual design cost reduction across wireless units of Nortel. Negotiated $1.15M in supply cost reduction (w/o design changes).

CA

• Matrix managed intro team for MG9000 outside plant cabinet VoIP line gateway. Mitigated cabinet supplier issues of water intrusion and a product defect which compromised seismic compliance.
• Product management prime for Chinese gateway partnership evaluations/negotiations. Ultimately led to shutting down a JV with the largest Chinese telecom equipment supplier.

CA

• Provided lifecycle management leadership including selling of strategy, account negotiations and authoring customer bulletins to cease support of 7 major product types spanning Core, I/O, Networking and Billing.
• Managed R&D budgets up to $3.25M.
• Managed 3-person team to prioritize/negotiate/maintain Spectrum Peripheral Module (SPM) S/W plan of record. The SPM product revenue for 2001 exceeded $1B.

• Completed thermal and physical design for a modular DMS cooling unit used in four telecom equipment cabinet configurations. (Flotherm/ProEng)
• Performed structural analysis (Ansys) and physical design for a staged attachment, die-cast PCB stiffener to ensure gull-wing solder joint integrity during wave solder and in later operation.
• Chaired MCAD team for design tools evolution.

• Drove prototyping and established manufacturing processes for DMS-10 Bay supervisory panels.
• Conducted manufacturability assessments and negotiated related enhancements with Design team.
• Trained manufacturing engineers in computer-aided design tools.