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Alec Pickett Email & Phone Number

TD Module and Integration Yield Engineer at Intel Corporation
Location: Hillsboro, Oregon, United States 4 work roles 3 schools
1 work email found @intel.com LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

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Work email a****@intel.com
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Current company
Role
TD Module and Integration Yield Engineer
Location
Hillsboro, Oregon, United States
Company size

Who is Alec Pickett? Overview

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Quick answer

Alec Pickett is listed as TD Module and Integration Yield Engineer at Intel Corporation, a with 133841 employees, based in Hillsboro, Oregon, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Alec Pickett.

Alec Pickett previously worked as TD Module & Integration Yield Engineer at Intel Corporation and Research Associate at University Of Missouri-Columbia. Alec Pickett holds Doctor Of Philosophy (Phd), Physics from University Of Missouri-Columbia.

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{first}.{last}@intel.com
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Profile bio

About Alec Pickett

Results-oriented process engineer and scientist with extensive experience in thin film metal deposition across both development and high-volume manufacturing environments. Proven track record of process optimization and automation implementation, driving significant operational improvements. Expertise in cost reduction, data analysis, and cross-functional collaboration, ensuring quality, reliability, and efficiency throughout the manufacturing process. Demonstrated success in streamlining operations, improving performance, and delivering measurable results in fast-paced environments.

Listed skills include Physics, Thin Films, Research, Mathematics, and 45 others.

Current workplace

Alec Pickett's current company

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Intel Corporation
Intel Corporation
TD Module and Integration Yield Engineer
santa clara, california, united states
Website
Employees
133841
AeroLeads page
4 roles

Alec Pickett work experience

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Td Module & Integration Yield Engineer

Hillsboro, Or

Work function metal and metal hard mask process engineering spanning sustaining, development, and high volume manufacturing.- Refined procedural workflows and implemented automated steps to achieve a 37% reduction in weekly maintenance procedures, saving hundreds of hours in equipment downtime.- Reduced within-wafer drive current variation by 25% through optimization of targeted process parameters.- Streamlined process flow around the metal work function module, reducing run-to-run variation by 14%.- Implemented cost saving initiatives to drive down weekly module spends by 35%, resulting in hundreds of thousands of dollars saved per year across all sites.- Optimized and reworked maintenance procedures to eliminate up to 70 hours per week of hands-on repair time.- Enhanced process chamber isolation procedures prior to adhoc tool maintenance and equipment pump maintenance, ensuring successful chamber recovery post-invasive work.- Identified equipment failure modes and designed automated containment measures to mitigate quality impacts.- Facilitated critical manufacturing decisions through data analysis, contributing to shorter tool-down times and increased output.- Refined automated data monitoring sensors to eliminate false aborts while also capturing and limiting true quality impacts.- Engaged in close collaboration with virtual factory counterparts to ensure global CE certification of equipment, fostering accelerated knowledge sharing for continuous process improvement.- Executed diverse sustaining responsibilities to facilitate high-volume manufacturing operations and uphold stringent quality standards.

Research Associate

Columbia, Missouri Area

• Formulated cutting edge research in the organic semiconductor field, investigating how film and polymer structure dictate electrical charge conduction, characterizing new materials, employing spectroscopy and electron microscopy techniques, and developing data-driven solutions.• Developed low-cost treatment processes for semiconducting films which resulted in 1000-times improvement in device current outputs.• Tripled the detectivity in near-infrared light sensors through simple film processing conditions. • Secured over $17,000 of individual project funding for experimentation and travel, in addition to $360,000 in lab grants.• Built a skill set in SEM and FIB milling to conduct cross-sectional TEM imaging on various materials while developing skills in EDX, EELS, and STEM imaging.• Published 4 scientific articles in prestigious and competitive academic journals through collaboration with a multicultural team of over 15 fellow scientists from 5 different countries.• Presented original research over a dozen times to various audiences at national APS and MRS meetings, a regional microscopy and microanalysis meeting, university symposia, as well as an invited colloquium and a radio interview.• Orchestrated multiple simultaneous projects from concept to final product by remaining organized, prioritizing tasks, and working efficiently with collaborators. • Represented and led the physics department graduate student body, delegated responsibilities to executives and members for 2 years, culminating in dozens of volunteer hours in public outreach and community service.

Jun 2015 - Dec 2019
Team & coworkers

Colleagues at Intel Corporation

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3 education records

Alec Pickett education

Doctor Of Philosophy (Phd), Physics

Activities and Societies: Physics and Astronomy Graduate Student Association (PAGSA) President (2016 and 2017) Physics and Astronomy.

Bachelor Of Science (Bs), Physics, 3.95/4 Gpa

Activities and Societies: Men's Soccer Sigma Pi Sigma (Physics National Honor Society) Kappa Mu Epsilon (Mathematics National Honor.

FAQ

Frequently asked questions about Alec Pickett

Quick answers generated from the profile data available on this page.

What company does Alec Pickett work for?

Alec Pickett works for Intel Corporation.

What is Alec Pickett's role at Intel Corporation?

Alec Pickett is listed as TD Module and Integration Yield Engineer at Intel Corporation.

What is Alec Pickett's email address?

AeroLeads has found 1 work email signal at @intel.com for Alec Pickett at Intel Corporation.

Where is Alec Pickett based?

Alec Pickett is based in Hillsboro, Oregon, United States while working with Intel Corporation.

What companies has Alec Pickett worked for?

Alec Pickett has worked for Intel Corporation, University Of Missouri-Columbia, and University Of Missouri.

Who are Alec Pickett's colleagues at Intel Corporation?

Alec Pickett's colleagues at Intel Corporation include Yong Quan Cheong, Madrigal, Francisco Madrigal Venegas, Syazwani Latfi, Shlomi Haliva, and Pawel Przygocki.

How can I contact Alec Pickett?

You can use AeroLeads to view verified contact signals for Alec Pickett at Intel Corporation, including work email, phone, and LinkedIn data when available.

What schools did Alec Pickett attend?

Alec Pickett holds Doctor Of Philosophy (Phd), Physics from University Of Missouri-Columbia.

What skills is Alec Pickett known for?

Alec Pickett is listed with skills including Physics, Thin Films, Research, Mathematics, Simulations, Teaching, Data Analysis, and Microsoft Excel.

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