Alexander Kaiser
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Alexander Kaiser Email & Phone Number

Head of R and D Thin Film Switzerland at Cicor Advanced Substrates
Location: Ulm, Baden-Württemberg, Germany 3 work roles 3 schools
1 work email found @cicor.com LinkedIn matched
✓ Verified Jun 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email a****@cicor.com
LinkedIn Profile matched
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Current company
Cicor Advanced Substrates
Role
Head of R and D Thin Film Switzerland
Location
Ulm, Baden-Württemberg, Germany

Who is Alexander Kaiser? Overview

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Quick answer

Alexander Kaiser is listed as Head of R and D Thin Film Switzerland at Cicor Advanced Substrates, based in Ulm, Baden-Württemberg, Germany. AeroLeads shows a work email signal at cicor.com and a matched LinkedIn profile for Alexander Kaiser.

Alexander Kaiser previously worked as Head of R&D Thin Film Switzerland at Cicor Advanced Substrates and Senior Technology Advisor at Cicor Advanced Substrates. Alexander Kaiser holds Phd (Dr.-Ing.) from Universität Ulm.

Company email context

Email format at Cicor Advanced Substrates

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{first}.{last}@cicor.com
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AeroLeads found 1 current-domain work email signal for Alexander Kaiser. Compare company email patterns before reaching out.

Profile bio

About Alexander Kaiser

Experience and Knowledge in:- ceramic packaging- thin film substrates technology- flexible substrates (medical implants, etc.)- thin film processes- semiconductor technology and processes- semiconductor devices- 3D integration technologies- different material systems (ceramic, polymer, diamond, silicon,…)- micro systems and MEMS- electrical and material characterization- - project management- cost calculation- writing of technical documentations, conference papers, etc.- making and giving presentations (English and German)- conducting technical trainings for Sales people or engineers, etc.- technically interfacing with customers- solution finding

Listed skills include Thin Film Technology, Flexible Substrates, Ceramic Packaging, Semiconductor Technology, and 27 others.

Current workplace

Alexander Kaiser's current company

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Cicor Advanced Substrates
Cicor Advanced Substrates
Head of R and D Thin Film Switzerland
Ulm, BW, DE
3 roles

Alexander Kaiser work experience

A career timeline built from the work history available for this profile.

Head Of R And D Thin Film Switzerland

Cicor Advanced Substrates

Ulm, BW, DE

Head Of R&D Thin Film Switzerland

Current
Cicor Advanced Substrates

Vilters-Wangs, Sankt Gallen, Schweiz

May 2023 - Present

Senior Technology Advisor

Current
Cicor Advanced Substrates

Ulm Und Umgebung, Deutschland

Jan 2014 - Present
3 education records

Alexander Kaiser education

Allgemeine Hochschulreife

Technisches Gymnasium Biberach
FAQ

Frequently asked questions about Alexander Kaiser

Quick answers generated from the profile data available on this page.

What company does Alexander Kaiser work for?

Alexander Kaiser works for Cicor Advanced Substrates.

What is Alexander Kaiser's role at Cicor Advanced Substrates?

Alexander Kaiser is listed as Head of R and D Thin Film Switzerland at Cicor Advanced Substrates.

What is Alexander Kaiser's email address?

AeroLeads has found 1 work email signal at @cicor.com for Alexander Kaiser at Cicor Advanced Substrates.

Where is Alexander Kaiser based?

Alexander Kaiser is based in Ulm, Baden-Württemberg, Germany while working with Cicor Advanced Substrates.

What companies has Alexander Kaiser worked for?

Alexander Kaiser has worked for Cicor Advanced Substrates.

How can I contact Alexander Kaiser?

You can use AeroLeads to view verified contact signals for Alexander Kaiser at Cicor Advanced Substrates, including work email, phone, and LinkedIn data when available.

What schools did Alexander Kaiser attend?

Alexander Kaiser holds Phd (Dr.-Ing.) from Universität Ulm.

What skills is Alexander Kaiser known for?

Alexander Kaiser is listed with skills including Thin Film Technology, Flexible Substrates, Ceramic Packaging, Semiconductor Technology, Publication And Presentation Skills, Customer Interaction, Electrical And Material Characterization, and Integration Techniques.

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