-- Data science and analytics-- DOEs, multi variant analysis, commonality, anomaly detection-- New product introduction, transition to production.-- Yield ramp acceleration-- IR Detector fabrication, characterization and packaging -- Product Engineering (Customer/vendor relationships, Documentation revision, continuous improvement)-- Semiconductor Manufacturing Best Practices (SPC, Cost Reduction)-- Molecular Beam Epitaxy (MBE) of III-V Materials (GaAs, GaN)-- Failure Analysis (8D Methodology, characterization techniques such as FIB)-- Semiconductor Characterization (SEM/EDX, AFM, XRD, Interferometry, Profilometer, etc.)