Technical Program Manager
- Implemented over 20 design changes across MS3XY, working with design and supply chain to insource parts, PC and OCC teams to arrange trials and validating with CMM, UT scanning, teardown, and/ or smoke testing at variable volume- Trialed and converted factory MOS label finish, working with consumables supplier to save $280,000/ yr. across M3Y- Aligned OCC, QE and CE teams to remove unnecessary MY adhesive paths, reducing cycle time 3s at bottleneck station- Designed die homelining Gantt chart to validate die shape and introduce 6016 material targeting 20% PIST improvement - Commonized T2 fasteners amongst T1 suppliers by analyzing EBOM for target TLAs, saving an estimated net $6/ M3+Y