Ali Ehsani, Phd Email & Phone Number

Rehovot, Il

Responsible for multiple metrology products for R&D and program management, including hardware, software, systems and program management.

Milpitas, California, Us

Manage technology transfer from CTO group to the product divisions.

Milpitas, California, Us

Poway, California, Us

Sr. Director of Engineering managing a porfolio of products including Tri-Temperature High-Performance handlers such as Pyramid and Summit, System Level Test Thermal Head Arrays such as LCBI and Fusion HD, Offline Binning handlers such as OLB, Thermal Core systems such as T-Core and ETC2K, machine vision solutions (V-Core), etc. Managing and mentoring program managers in addition to other engineering staff.

Milpitas, California, Us

Dark-field Program Manager, Wafer Inspection Group, Milpitas, CA (2006-Mar. 2012)Managed a $50M (more than 100 resources) dark-field wafer inspection (32 nm node) program from technical risk retirement to product release. Exceeded sensitivity/performance, reliability and manufacturing cycle-time reduction goals. Met GM goals.• Hands-on development, risk retirement, and productization for: New higher speed linear sensor/electronics, new mode-locked laser with higher power, much improved VOC control and higher pulse rate, new image computers (servers) and electronics, and new optics/mechanics• Developed detail schedule and budget for all phases of program to meet business objectives (technical risk retirement, planning, development & prototype test, characterization, beta and release)• Managed key vendors to meet specs, yield, reliability and cost targets (e.g., laser, image computer, electronics, optics, tooling contractors)• Selected and worked with a vendor to define requirements, design, develop, test and successfully install a precision class-10 compliant macro-lens pick and place tool to automate macro-lens placement on 1D linear sensor • Successful demo to all customers (exceeding expectations) resulting in multiple orders (during downturn)• Developed metrics and calibration tools resulting in out-of-the-box matching performance between first 5 tools at customer sites• Managing analog, digital and firmware engineers responsible for design of high-speed camera system, delivering state of the art electronics

Milpitas, California, Us

Image Computer Program Manager and Electronics Functional Manager, Wafer Inspection Group, Milpitas, CA (2004-2006)Managed the image computer program across multiple divisions and managed the digital electronics/firmware group responsible for data-path electronics and firmware for Wafer Inspection Group• Managed server-based image computer group (cluster of computer nodes) across multiple products surpassing requirements for compute budget, cost and reliability• Managed electronics/FW group to design high-speed data-path (multi Gpixels/sec) from optical fiber input (from camera) to PCIX or PCIE DMA in the servers. Met schedule, reliability and cost targets• Worked with software group (local and remote) to define requirements, develop and test the new image computer platform• Worked with offshore firm to develop a low-cost alternative hardware/firmware as part of the image computer hardware solution

Milpitas, California, Us

Bright-field Engineering/Program Manager and Electronics Functional Manager, Wafer Inspection Group, Milpitas, CA (2002-2004)Engineering manager for a bright-field wafer inspection tool. Became program manager of the product after product was released. Also managed the electronics/firmware group to design and implement custom data-path electronics to support multi-generation of bright-field products• Presented and resolved tool related issues to beta site customers during beta and post release.• Hands-on manager for electronics/firmware group to design high-speed digital hardware with FPGAs, DDR2, ASICs and optical transceivers. All boards were designed, developed and tested per schedule and met reliability and cost targets• Trained the entire engineering and software groups in problem solving methodology (7-step problem solving), creating a common methodology to solve and communicate technical problems

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Program Manager, Electron Beam Products Group, Hayward, CA (2001-2002)Developed the next generation (70 nm node) electron beam mask pattern generator. Managed 40 internal resources plus external contractors. Presented program status and results to the CEO and external customers.• Improved the prototype system to deliver the first 70 nm lithographic results• Secured funding and staffing by creating a detailed schedule for integration of the alpha and beta systems• Spearheaded the design, manufacturing and testing of all hardware and software modules resulting in an on-time start of alpha integration

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Manager - Advanced Technologies Group, Laser Direct Imaging, Tucson, AZ (2000-2001)Directed key technical resources in the development of a next generation laser direct imaging system for the PCB industry.• Developed technology roadmap, IP strategy and portfolio, and analyzed competition's technology• Shortened the product development cycle by delivering technological solutions (C&F) to the engineering group• Improved next generation products by collaborating with external suppliers such as laser, AOM, and photoresist

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Project Manager, Laser Direct Imaging Group, Tucson, AZ (1997-2000)Managed key projects to solve technical challenges in the development of a robust laser direct imaging tool for the PCB industry. Reported results and progress to customers• Led a diverse group of engineers to research and identify causes for limited imaging resolution for a laser direct imaging system for the PCB industry, resulting in three new corrective designs• Improved performance, yield and reliability of a laser direct imager tool which accelerated the market acceptance of the imaging tool• As the principal investigator, wrote a proposal to NIST for a multi-million dollar laser direct imaging projectSenior Electrical Engineer, Laser Direct Imaging Group, Tucson, AZ (1996-1997)Worked on a variety of technical tasks in research and development of a laser direct imaging tool.• Reduced the data storage and bandwidth requirements by a factor of five by designing new hardware for a real-time VME based decompression and RAID interface in conjunction with development and simulation of a new data decompression algorithm• Demonstrated increased resolution by a factor of 15 by defining and modeling grayscale strategy• Programmed machine vision solutions (C and C++), which improved the registration Capability and reliability for printed circuit boards• Designed a micro-controller multi-functional mixed signal board, which simplified board replacement and reduced cost and training time