Alin-Constantin Florea Email & Phone Number

Bucharest, Ro

Bucharest, Romania

Bucharest, Romania

Bucharest, Romania

Bucharest, Romania

Bucharest, Romania

Responsibilities:Manage the Design and Simulation activities within the Packaging DepartmentPackage Roadmap Simulation Services RoadmapImprove PLOC templates for 2.5D, Flip-Chip and Wirebond type packages Training within department, but also to other departmentsBesides managing activities I also continue to have engineering activities and perform package selection, IO ring planning, package design/simulation and release to manufacturing for complex devices, to balance workload within department

Bucharest, Romania

Package selection, design, simulation and released successfully to manufacturing.Worked on various projects that had many challenges like: *96 SerDes channels running at 14Gbps combined with high-power computing (200W) *Dual I/O Ring with 128 SerDes channels running at 6.25Gbps in 5-2-5 build-up package along with a 64bit DDR2 interface *512 bit DDR3 at 2133Mbps along with a 20GHz DAC interface *Hybrid package with Wirebond DRAM die placed on top of a flip-chip ASIC with very small form factor *Wirebond die planned so it can be assembled in a TFBGA, DR-QFN and QFN without any changes to the die pad layout *4 channel SerDes running at 14GHz in a Wirebond package

Bucharest, Romania

Developed skills for I/O ring planning, package design and simulation.Worked on wirebond and flip-chip packages

Bachelor, Microelectronics

Education record