I am a current quality assurance in ASE (DQE). My responsibilities are to check process capability for optical and MEMS NPI by cpk and cooperating with different departments when issues occur, ensuring process improvement and product quality.During the ASE tenure, important cases as followed:1. Qualification review and confirm product quality and qualification document Approved 20 cases to proceed next phaseReject 3 cases to proceed next phase2. Structure Design and whole process capability reviewLGA, BGA package deisgn checkVerify update LGA, BGA design ruleWafer grinding, Wafer saw, Die bond, Wire bond, Molding, Lid attach, underfill, Package saw, solder paste process capability review.Wafer grinding, Wafer saw, Die bond, Wire bond, Molding, Lid attach, underfill, Package saw, solder paste capability rule update.3. Define new product detectability. Provided new proposal for customer agree to buy 2.9 millions of new measurement equipment and they agreed. Define new measurement method to avoid defect sample product to be release. (lens ~ die distance)4. Quality control and detection monitorAnalyze raw data and monitor if there are outliers. Demand internal team tighten spec and control limit.Control plan, OCAP, SPEC, SOP, DFMEA, PFMEA review and update.

I had been an R&D engineer of assembly house for approximately four years. As the process leader of the factory, I needed to conduct process evaluation and development of new products, improve the process of mass production, imported automated production, and formulate process related documents (SPEC, PFMEA, OCAP And other relevant documents). I also had to cooperate with many different departments and present the best option to the customers.My responsibilities include but not limited to Wafer grinding / Wafer Saw / Steal dicing / Package Saw. Each process is closely related, as a result I also had a wide understanding of other processes such as Die bond / Wire bond / Modeling etc...During this period, I had dealt with important cases as followed:1. Leading Light Sensor product process improvement (package saw-burr out of spec), which improved the yield by 99.9%, and introduced mass production, which has a capacity of 5kk per month2. Developing automation equipment, and by purchasing this 10 million-worth equipment, our customers were able to locate production problems when occurred3. Leading the Pressure Sensor product process improvement (package saw-chipping yield loss > 1700ppm), reducing the chipping defect rate down to 100ppm4. Leading wafer saw process by more than 40%, UPH increased by more than 10%5. Developing new tapes, reducing factory consumable costs by more than 15%.