R. Alan May Email and Phone Number

Jan 2016 - Current:Pathfinding integration, responsible for enabling next generation packaging building blocks for heterogeneous integration, 2.5D package scaling and high density organic package scaling.April 2013 - Dec 2015Metallization engineering, responsible for enabling next generation Electroplating, Electroless Plating, Surface Modification, Wet Etching, Surface Finish and Adhesion Promotion technologies for high density package substrates

• Determined the kinetics, direction and length distribution of crack formation during the crystallization of amorphous solid water. Then, used angle dependent ballistic deposition to control the porosity of nanostructured amorphous solid water to enumerate various low temperature desorption pathways of trapped gases.• Measured diffusion of rare gases through supercooled hydrocarbons such as benzene, toluene and ethylbenzene to determine how diffusivity changes near the glass transition temperature.• Utilized ultra-high vacuum system to characterize the dewetting of amorphous solid water from carbon tetrachloride using temperature programmed desorption and infrared spectroscopy.

• Designed, built, and operated a hybrid generalized ellipsometry/quartz crystal microbalance porosimetry apparatus for characterizing porous thin films such as nanoporous TiO2 deposited via ballistic deposition and MoO3 deposited via electrodeposition on Au coated QCM crystals.• Synthesized materials and analyzed the relationship between the optical and structural properties of nanoporous mixed transition metal oxide thin films and the subsequent effect on performance as electroactive and/or electrochromic materials.• Developed procedure to chemically etch indium tin oxide coated glass to create transparent interdigitated micro-electrodes functionalized with electrodeposited MoO3 and WO3 for use as redox active optical sensors.