Amir Ardavan A. Email & Phone Number
@semtech.com
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Who is Amir Ardavan A.? Overview
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Amir Ardavan A. is listed as Principal IC Packaging Engineer (Signal Integrity) at Semtech at Semtech, a with 1 employees, based in San Diego, California, United States. AeroLeads shows a work email signal at semtech.com and a matched LinkedIn profile for Amir Ardavan A..
Amir Ardavan A. previously worked as Principal IC Packaging Engineer (Signal Integrity) at Semtech and Senior Staff IC Packaging Engineer (Signal Integrity) at Semtech. Amir Ardavan A. holds Master Of Applied Science, Electrical And Computer Engineering from Carleton University.
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About Amir Ardavan A.
•10 years industry experience in package and PCB design, electromagnetic (EM) modeling , signal integrity analysis and optimization for ICs, packages and PCBs• More than 5 years direct interface experience with package substrate supplier, assembly vendors, and module design customers• 5 years experience as a package prime lead design for various high-frequency products• Expertise in modeling and optimizing high speed signal path from IC to optical/host connector interface (10-400G/NRZ-PAM4 module)• Highly experienced in high-frequency 3D modeling for ICs (driver, receiver, CDR, EQ,VCO)• Extensive knowledge of different high-speed packaging materials and technologies• Familiarity with assembly processes, reliability standards, thermal considerations and FA techniques• Expertise in correlation between lab measurements and simulation data (Return Loss/TDR)• Familiarity with different lab measurement techniques and equipment • Simulation and modeling tools: Ansys/HFSS-Q3D-SiWave, Keysight/Schematic-Momentum-EMPro-RFPro, EMX, Synopsys/HSPICE • Design tools: Allegro Package Designer, Allegro PCB editor, Cadence Virtuoso• CAD tools: AutoCAD, Draftsight, Klayout• Programming: MATLAB, Python, CNon-technical skills• Excellent leadership and time management skills• Proven track record working with various internal teams and vendors• Highly skilled and comfortable with multi-tasking who can work independently on different products at the same time• Extensive experience in preparing, documenting, presenting and reviewing technical reports
Listed skills include Packaging, C/C++, Hfss, Signal Integrity, and 38 others.
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Amir Ardavan A. work experience
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Senior Staff Ic Packaging Engineer (Signal Integrity)
Senior Staff Ic Packaging Engineer (Signal Integrity)
• Lead Design for IC packages to meet new products and developed solutions to achieve highest level of quality and reliability requirements to meet industry requirements (WLCSP-WLFO-FCBGA-SIP-3D packaging)• Prime lead for 3D electromagnetic (EM) simulation, model extraction, and signal integrity analysis of high-speed interconnects at IC, package, and PCB levels (Optical 100G/400G Transceiver design)• Worked directly with IC and PCB designers for high-frequency design improvement of signal path• Processed system level measurements data and refined simulation models to improve the accuracy of the models • Expert in high-frequency IC 3D modeling (TowerJazz SiGe H3/H5 driver, receiver, CDR, EQ, VCO) • Expert in modeling high-frequency matching networks on the package or PCB substrate• Directly involved in IC, package and PCB design/layout tape-out process and DFM procedure• Closely mentored and monitored entry-level engineers to become familiar with different aspect of design flow and implementation • Daily user of simulation tools such as Ansys HFSS/SiWave, Keysight/ADS-EMPro• Frequent user of layout tools such as Allegro APD/PCB editor, Cadence Virtuoso, AutoCAD, DraftSight
Staff Ic Packaging Engineer (Signal Integrity)
Ic Packaging Engineer
Research Assistant
• Performed research on Optoelectronic system modeling and design automation • Developed a novel approach for steady-state simulation of Optoelectronic/Microwave-Photonic systems, accepted for publication, Transactions on Component, Packaging, and Manufacturing Technology• Developed novel circuit-level models for Laser Diode and Optical Fiber to be used in the well-known Harmonic Balance framework, accepted for publication, Transactions on Component, Packaging, and Manufacturing Technology• Implemented a self-consistent OptiSPICE-like simulator for simulation of Optoelectronic circuits in C• Created a self-consistent SPICE-like transient simulator for simulation of nonlinear electrical circuits in MATLAB• Implemented a self-consistent steady-state simulator for simulation of single/multi-tone nonlinear electrical circuits in MATLAB• Experience working with Agilent/ADS, Synopsys/HSPICE, and Optiwave/OptiSPICE• Understanding of fiber-optic communication, optical propagation/dispersion/nonlinearity, signal integrity issues, convergence issues, numerical methods, linear algebra, variability, MOR, floorplaning, placement, partitioning and routing algorithms, ,and sparse matrix techniques through graduate courses
Teaching Assistant
Electronics I (ELEC2507) , Electronics II (ELEC3509)• Conducting several teaching/laboratory assistant sessions, helping/managing students/TAs
Colleagues at Semtech
Other employees you can reach at semtech.com. View company contacts for 1 employees →
Saurabh Khanvilkar
Colleague at SemtechPune, Maharashtra, India
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AT
Alan Trainor
Colleague at SemtechGreater Bristol Area, United Kingdom
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RW
Russell Witte
Colleague at SemtechCamarillo, California, United States
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吕
吕泰生
Colleague at SemtechMinhang District, Shanghai, China
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GL
Guevara Leal Estefania
Colleague at SemtechDallas, Texas, United States
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SB
Simon Brown
Colleague at SemtechDel Mar, California, United States
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JI
Just In
Colleague at SemtechJiddah, Makkah, Saudi Arabia
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IJ
Ian Jacobs
Colleague at SemtechTroy, Michigan, United States
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JL
Jesus Loya
Colleague at SemtechReynosa, Tamaulipas, Mexico
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RM
Ruturaj M.
Colleague at SemtechPune, Maharashtra, India
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Amir Ardavan A. education
Master Of Applied Science, Electrical And Computer Engineering
Bachelor Of Science (B.Sc.), Electrical And Computer Engineering
Frequently asked questions about Amir Ardavan A.
Quick answers generated from the profile data available on this page.
What company does Amir Ardavan A. work for?
Amir Ardavan A. works for Semtech.
What is Amir Ardavan A.'s role at Semtech?
Amir Ardavan A. is listed as Principal IC Packaging Engineer (Signal Integrity) at Semtech at Semtech.
What is Amir Ardavan A.'s email address?
AeroLeads has found 1 work email signal at @semtech.com for Amir Ardavan A. at Semtech.
Where is Amir Ardavan A. based?
Amir Ardavan A. is based in San Diego, California, United States while working with Semtech.
What companies has Amir Ardavan A. worked for?
Amir Ardavan A. has worked for Semtech and Carleton University.
Who are Amir Ardavan A.'s colleagues at Semtech?
Amir Ardavan A.'s colleagues at Semtech include Saurabh Khanvilkar, Alan Trainor, Russell Witte, 吕泰生, and Guevara Leal Estefania.
How can I contact Amir Ardavan A.?
You can use AeroLeads to view verified contact signals for Amir Ardavan A. at Semtech, including work email, phone, and LinkedIn data when available.
What schools did Amir Ardavan A. attend?
Amir Ardavan A. holds Master Of Applied Science, Electrical And Computer Engineering from Carleton University.
What skills is Amir Ardavan A. known for?
Amir Ardavan A. is listed with skills including Packaging, C/C++, Hfss, Signal Integrity, Simulation Modeling, Tdr, Ic Packaging, and Algorithms.
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