Amir Ardavan A.
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Amir Ardavan A. Email & Phone Number

Principal IC Packaging Engineer (Signal Integrity) at Semtech at Semtech
Location: San Diego, California, United States 7 work roles 2 schools
1 work email found @semtech.com LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 100%

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Current company
Semtech
Role
Principal IC Packaging Engineer (Signal Integrity) at Semtech
Location
San Diego, California, United States
Company size
1 employees

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Amir Ardavan A. is listed as Principal IC Packaging Engineer (Signal Integrity) at Semtech at Semtech, a company with 1 employees, based in San Diego, California, United States. AeroLeads shows a work email signal at semtech.com and a matched LinkedIn profile for Amir Ardavan A..

Amir Ardavan A. previously worked as Principal IC Packaging Engineer (Signal Integrity) at Semtech and Senior Staff IC Packaging Engineer (Signal Integrity) at Semtech. Amir Ardavan A. holds Master Of Applied Science, Electrical And Computer Engineering from Carleton University.

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Email format at Semtech

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*@semtech.com
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About Amir Ardavan A.

•10 years industry experience in package and PCB design, electromagnetic (EM) modeling , signal integrity analysis and optimization for ICs, packages and PCBs• More than 5 years direct interface experience with package substrate supplier, assembly vendors, and module design customers• 5 years experience as a package prime lead design for various high-frequency products• Expertise in modeling and optimizing high speed signal path from IC to optical/host connector interface (10-400G/NRZ-PAM4 module)• Highly experienced in high-frequency 3D modeling for ICs (driver, receiver, CDR, EQ,VCO)• Extensive knowledge of different high-speed packaging materials and technologies• Familiarity with assembly processes, reliability standards, thermal considerations and FA techniques• Expertise in correlation between lab measurements and simulation data (Return Loss/TDR)• Familiarity with different lab measurement techniques and equipment • Simulation and modeling tools: Ansys/HFSS-Q3D-SiWave, Keysight/Schematic-Momentum-EMPro-RFPro, EMX, Synopsys/HSPICE • Design tools: Allegro Package Designer, Allegro PCB editor, Cadence Virtuoso• CAD tools: AutoCAD, Draftsight, Klayout• Programming: MATLAB, Python, CNon-technical skills• Excellent leadership and time management skills• Proven track record working with various internal teams and vendors• Highly skilled and comfortable with multi-tasking who can work independently on different products at the same time• Extensive experience in preparing, documenting, presenting and reviewing technical reports

Listed skills include Packaging, C/C++, Hfss, Signal Integrity, and 38 others.

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Amir Ardavan A.'s current company

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Semtech
Semtech
Principal IC Packaging Engineer (Signal Integrity) at Semtech
Camarillo, CA
Website
semtech.com
Employees
1
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7 roles

Amir Ardavan A. work experience

A career timeline built from the work history available for this profile.

Principal Ic Packaging Engineer (Signal Integrity)

Current
Semtech

Camarillo, CA, US

Jul 2022 - Present

Senior Staff Ic Packaging Engineer (Signal Integrity)

Semtech

Camarillo, CA, US

Dec 2021 - Jun 2022

Senior Staff Ic Packaging Engineer (Signal Integrity)

Semtech

Camarillo, CA, US

  • Lead Design for IC packages to meet new products and developed solutions to achieve highest level of quality and reliability requirements to meet industry requirements (WLCSP-WLFO-FCBGA-SIP-3D packaging)
  • Prime lead for 3D electromagnetic (EM) simulation, model extraction, and signal integrity analysis of high-speed interconnects at IC, package, and PCB levels (Optical 100G/400G Transceiver design)
  • Worked directly with IC and PCB designers for high-frequency design improvement of signal path
  • Processed system level measurements data and refined simulation models to improve the accuracy of the models
  • Expert in high-frequency IC 3D modeling (TowerJazz SiGe H3/H5 driver, receiver, CDR, EQ, VCO)
  • Expert in modeling high-frequency matching networks on the package or PCB substrate
Nov 2018 - Dec 2021

Staff Ic Packaging Engineer (Signal Integrity)

Semtech

Camarillo, CA, US

Feb 2016 - Oct 2018

Ic Packaging Engineer

Semtech

Camarillo, CA, US

Dec 2013 - Jan 2016

Research Assistant

Carleton University

Ottawa, Ontario, CA

  • Performed research on Optoelectronic system modeling and design automation
  • Developed a novel approach for steady-state simulation of Optoelectronic/Microwave-Photonic systems, accepted for publication, Transactions on Component, Packaging, and Manufacturing Technology
  • Developed novel circuit-level models for Laser Diode and Optical Fiber to be used in the well-known Harmonic Balance framework, accepted for publication, Transactions on Component, Packaging, and Manufacturing Technology
  • Implemented a self-consistent OptiSPICE-like simulator for simulation of Optoelectronic circuits in C
  • Created a self-consistent SPICE-like transient simulator for simulation of nonlinear electrical circuits in MATLAB
  • Implemented a self-consistent steady-state simulator for simulation of single/multi-tone nonlinear electrical circuits in MATLAB
Sep 2011 - Sep 2013

Teaching Assistant

Carleton University

Ottawa, Ontario, CA

  • Electronics I (ELEC2507), Electronics II (ELEC3509)
  • Conducting several teaching/laboratory assistant sessions, helping/managing students/TAs
Jan 2012 - Apr 2013
Team & coworkers

Colleagues at Semtech

Other employees you can reach at semtech.com. View company contacts for 1 employees →

BG Barbara Gilo Barbara Gilo Colleague at SemtechCanada, Canada View → RK Rifat Kısacık, Phd Rifat Kısacık, Phd Colleague at SemtechBishop's Stortford, England, United Kingdom, United Kingdom View → YY Yong Yang Guan Yong Yang Guan Colleague at SemtechShanghai, China, China View → RD Richard Dykee Richard Dykee Colleague at SemtechCentral Luzon, Philippines, Philippines View → KD Kat Dempsey Kat Dempsey Colleague at SemtechGreater Melbourne Area, Australia View → IS Indrani Sunnakasalu Indrani Sunnakasalu Colleague at SemtechKedah, Malaysia, Malaysia View → YV Yashwini Vthaya Surian Yashwini Vthaya Surian Colleague at SemtechIpoh, Perak, Malaysia, Malaysia View → MC Miki Chen Miki Chen Colleague at SemtechShenzhen, Guangdong, China, China View → CA Cecilia Aguila Cecilia Aguila Colleague at SemtechMexico, Mexico View → AS Aditya Singh Aditya Singh Colleague at SemtechVaranasi, Uttar Pradesh, India, India View →
2 education records

Amir Ardavan A. education

Master Of Applied Science, Electrical And Computer Engineering

Carleton University

Bachelor Of Science (B.Sc.), Electrical And Computer Engineering

Isfahan University Of Technology
FAQ

Frequently asked questions about Amir Ardavan A.

Quick answers generated from the profile data available on this page.

What company does Amir Ardavan A. work for?

Amir Ardavan A. works for Semtech.

What is Amir Ardavan A.'s role at Semtech?

Amir Ardavan A. is listed as Principal IC Packaging Engineer (Signal Integrity) at Semtech at Semtech.

What is Amir Ardavan A.'s email address?

AeroLeads has found 1 work email signal at @semtech.com for Amir Ardavan A. at Semtech.

Where is Amir Ardavan A. based?

Amir Ardavan A. is based in San Diego, California, United States while working with Semtech.

What companies has Amir Ardavan A. worked for?

Amir Ardavan A. has worked for Semtech and Carleton University.

Who are Amir Ardavan A.'s colleagues at Semtech?

Amir Ardavan A.'s colleagues at Semtech include Barbara Gilo, Rifat Kısacık, Phd, Yong Yang Guan, Richard Dykee, and Kat Dempsey.

How can I contact Amir Ardavan A.?

You can use AeroLeads to view verified contact signals for Amir Ardavan A. at Semtech, including work email, phone, and LinkedIn data when available.

What schools did Amir Ardavan A. attend?

Amir Ardavan A. holds Master Of Applied Science, Electrical And Computer Engineering from Carleton University.

What skills is Amir Ardavan A. known for?

Amir Ardavan A. is listed with skills including Packaging, C/C++, Hfss, Signal Integrity, Simulation Modeling, Tdr, Ic Packaging, and Algorithms.

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