Amir Asgari personal email
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• A Principal Talent Acquisitions of Global Market with broad knowledge in all aspect of Hardware, Software, Artificial Intelligence, Quality and biomedical, etc. Specialties in semiconductor design and development phases such as: Architecture, Logic Design, Pre & Post-Silicon Verification, Circuit Design, Physical Design, DFT, Synthesis & Timing, Mask layout, Packaging, Bring-up, Prototype, Diagnostics Tests and Technical writing.• Experienced in all phases of Talent Acquisitions process which includes Technical Engineering and Executive Recruitment, University Relations, Campus Recruiting, Mentoring and guiding hiring managers, End-to-End staffing and recruitment process, Career Coaching and Development Expertise, Global and International Relocations, Applicant Tracking System expertise, Professional/HR Leadership and all aspect of foreign Visa and Immigration policies such as H-1B/1C, H-2A/2B, H-3, F1/OPT/CPT, L1, TN Visa & others.• Extensive expertise & experience in quickly understand hiring manager’s business & talent needs, identify the best qualified candidates with regards to critical skills and diversity, main effective working relationships, mentor team leads when needed, committed to managing operations and projects flawlessly while contributing to revenue-producing activities.• Keen understanding of manager’s responsibilities such as Company’s global objectives, Division/Team strategy, planning, implementation, policies, assigning/directing, guiding/mentoring and employees’ growth, monitoring growth and feedback, appraising performance, and many more. Received PMP Certification.• Cross-functional communicator who works well with high profile staff, vendors, and customers. • Able to quickly adapt to new businesses, client needs and specific talent pools for a new organization.• Nominated multiple times as a “Personnel manager of the year” under IBM Systems & Technology Group (STG) Division in RTP, North Carolina.• Excellent Communication/Presentation, Interpersonal skills as well as being individual contributor• Keen to develop new skills & face new challenges (Seminars/classes). Quickly builds rapport with individualsSpecialized in recruiting for the below segments:• Semiconductor (extensively): All aspects of ASIC/SoC/Chip Design process, Project Managers (PMI/PMP), • Software: Embedded/Software development/Tests, Wireless & Mobile Communications, Networking, etc. • Electronics: All Hardware/Electronics disciplines.-For further collaborations, please contact me at Amir@sabatalent.com
Saba Talent/Ten, Amd, Microsoft, Qualcomm, Marvell, Analog Devices, Ibm.
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Principal Technical Consultant Recruiter, Hardware, Software, Semiconductor, Ai, It, Etc.Saba Talent/Ten, Amd, Microsoft, Qualcomm, Marvell, Analog Devices, Ibm. Aug 2013 - PresentMain domains of recruitment expertise:1. Semiconductor (extensively): Board Design, Chip Design, VLSI, Logic Design (Verilog/VHDL), Verification, Validation, Physical Design, Synthesis/Timing, Design For Test (DFT), IC Mask Layout, Packaging, Circuit Design, Digital, Analog, Mixed Signal, Low Power, Signal and Power Integrity, Prototype, Bring-up, Post Silicon, FPGA, Diagnostic, Technical Writing, Embedded Firmware, SPICE, PSPICE, RF, RFID. 2. Wireless & Mobile Communications (LTE/G5/G4/G3/G2), Networking & Telecommunications, Automation3. Software development/Tests, Cloud Computing, Enterprise & Mobile Security sectors, IoT, Full Stack, etc. Specific specializations: A. Linux/Unix/Windows, SQL, C#, Objective-C, Perl/TCL/SHELL, ANDROID/IOS B. Web languages: JavaScript, Java, Python Django/Flask, CSS, PHP, Ruby/Rails, C++, C language, HTMLC. Data Analytics, Big Data, Machine/Deep Learning4. Quality Assurance, Quality Control, Cosmetics, Biomedical Engineers, Pharmas, Biotech, Medical devices, Access & Affairs, Regulatory Affairs, Clinical (Operations), FDA regularities, Process Technologies, Sales & Marketing, and (higher) management (incl. board).5. Electronics: Various board designs, HMI, PCB, Altium, ORCAD, PADS, Solder, Thru-hole, Surface Mount, Real Time Design, Power Electronics, Controls Systems, Sensors, Power Electronics, Power Handling, Low Power Sensing, Matlab, Simulink, Labview, Spectrum Analyzer, Electro-Magnetics, Amplifiers, Dry Etching, Scanning Electron Microscope, Tests, Wafer-Level Board Packaging, Technician, etc.6. Technical Information Technology (IT) support and development.7. Program/Project Manager (PMI and/or PMP)- Please call me at 919.656.9557
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Technical Manager, Powerpc Microprocessor Logic Design/Verification/ValidationIbm Sep 2011 - Sep 2013Armonk, New York, Ny, Us• Focal point for all IBM PowerPC microprocessor Level 3 support hardware and software issues.• Managed issues database, assigned priorities, worked closely with the global team (multiple disciplines), 3rd parties and customers on successful technical analysis and resolution. Provided weekly status to upper management. Maintained strong and favorable relationships with our clients. • Managed projects and resolved 900+ issues in less than 3 years with savings of over $250 M.• Held meetings with the team to develop and productively recommend better service quality improvements to our partners and customers.• Coordinated 3rd party core updates/fixes to effectively merge into IBM release processes. • Effectively managed post mortem/lessons learned to identify opportunities to eliminate future customer issues, increasing customer satisfaction and performance in the marketplace. -
Manager, Powerpc Microprocessor Development And Ip DeliveriesIbm Sep 2008 - Sep 2011Armonk, New York, Ny, Us• Managed and led full execution of multi IP verification taskforce on system on chip for PPC476 microprocessor and bus interface cores. Created and established global strategy and planning among cross functions and 3rd parties.• Successfully brought in the project, released to several IBM internal and external customers. o Managed 26 global technical professional overseeing verification plan, test plan, gathering tests, establishing environment and modeling in high level design language, test cases in deterministic and random format, coverage points, checkers, monitors and modified new functionalities. o Hosted “post mortem/lessons learned” analysis to ensure correct processes were applied.• In PowerPC 476 processor verification, led a global processor verification team of 16 professionals in US and India in 2 different companies, working with technical leads on definitions, work assignments, schedules and milestones. The processor was released to our external customer LSI and IBM internal customers on time without any severity 1, 2 or 3 defects. • For the PLB6 (bridge interface core), released PLB6 cores to IBM internal and external customers on time and with zero defects. Managed the global logic and verification team: managed and maintained overall schedule, worked with logic and verification leads to ensure key milestones were achieved on time, actively worked with 3rd party IP (Cadence) on modeling and environment deliverable and worked closely with other geographical managers and engineers to successfully balance resources and tasks during the critical juncture of the projects.• Worked closely with customers and achieved successful implementation and execution of core releases in their environments with no impact to their schedules. Managed the following Releases: Managed and led a team of 5 in US, India and China developing and releasing Smart Models and Architectural Verification Programs for several PowerPC processors (PPC405S/460S/470S).
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10/2005 – 8/2008: Engagement Manager, Asic Design Center Solutions (Processors, Socs, I/Os)Ibm Oct 2005 - Aug 2008Armonk, New York, Ny, Us• Achieved technical project management from kick-off to prototype release to customer. This included Initial Design Review (IDR), release to floor-plan, preliminary design, layout, checking, mask and prototype delivery. • Planned and managed technical reviews, drove closure of all technical issues, execution and follow-up. Identified and resolved technical risk areas and schedule impacts. Tracked custom and new technology development commitments related to individual designs. • Managed resources, schedule and cost relative to quote sizing. • Drove weekly meetings with customer, IBM system engineering, sales teams and communicated the results to upper management and held “lessons learned” reviews with customer and IBM teams at the end of each project.• Managed development of Six chips (Cisco, Nortel, China Huawei/HiSilicon) in 90/130 nm by going beyond expectations to insure successful completion, including providing technical quotes and expertise to customers, pre-sales and FAE team for customer executive briefing as well as new business opportunities• Executed on new AB's, and B's (metal only) releases to support development & standard products.• Actively engaged with colleagues on Post Release to Manufacturing chip follow ups, working with manufacturing and sales to insure efficient production and first time right decisions. • Insured talent development by sharing knowledge with colleagues, contributing to the ASIC Design Center community thru publications, skill group exchanges and mentoring.
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Engineering Development Manager, Powerpc Embedded Microprocessor DevelopmentIbm Aug 1999 - Oct 2005Armonk, New York, Ny, Us• Chosen for leadership responsibilities after stepping up to an open management position after the sudden departure of three levels of design team management and critical experienced design team members (52 hardware and software engineers). Re-staffed the team and delivered PowerPC 450 microprocessor core to several internal and external customers. • Received IBM corporate awards for outstanding management and delivery of key business products: o Managed overall micro-architecture, logic design, synthesis, timing, and verification team of the PPC450 microprocessor and the PPC450L2 cache unit. o Facilitated strong technical communications with key customers, such as the IBM Server Group and various IBM external customers (SONY, LSI, Ericsson, AMCC). o Managed and delivered the Smart and CycleSim models for PPC450 and CoreConnect customers.• Managed the team and provided random test-case generation tool support (primary tools support interface to IBM Research, Haifa) for microprocessor and peripheral cores.
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Vlsi Design/Verification, Engineering Project Manager, Product Engineering ManagerIbm Apr 1984 - Jul 1999Armonk, New York, Ny, Us• Worked and contributed to several engineering divisions and accelerated through ranking with leadership roles and ultimately into management positions.• Designed/Verified/Timed memory controller, bridges and several IO controllers for PS2 servers. Verified local & system bus, developed test-bench environment, models and written many test-cases.• Worked on PC AT mother board and completed many tests in several LABs and EMC chamber.
Amir Asgari Skills
Amir Asgari Education Details
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Wayne State UniversityElectrical & Computer Engineering -
Wayne State UniversityElectrical & Computer Engineering
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University Of MichiganPhysics
Frequently Asked Questions about Amir Asgari
What company does Amir Asgari work for?
Amir Asgari works for Saba Talent/ten, Amd, Microsoft, Qualcomm, Marvell, Analog Devices, Ibm.
What is Amir Asgari's role at the current company?
Amir Asgari's current role is Principal Engineering Talent Acquisition to Leading Organizations. #sourcing, #recruiting, #Hiring, #Jobs, #Careers, #OpenDoors, #OpenToNewOpportunity, #Readytowork, #Opentowork.
What is Amir Asgari's email address?
Amir Asgari's email address is aa****@****ail.com
What schools did Amir Asgari attend?
Amir Asgari attended Wayne State University, Wayne State University, University Of Michigan.
What are some of Amir Asgari's interests?
Amir Asgari has interest in Customer Focus And Relationship, Economic Empowerment, Interests, Soccer, Politics, Education, Golf And Listen To Classical Music, Environment, New Technologies, Science And Technology.
What skills is Amir Asgari known for?
Amir Asgari has skills like Asic, Embedded Systems, Testing, Processors, Soc, Hardware, Debugging, Ic, Program Management, Microprocessors, Perl, Cross Functional Team Leadership.
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