Engineering executive with extensive hands-on experience overseeing semiconductor operations, product development, supply chain, product and test engineering, package and assembly teams. Responsible for delivering on corporate goals for cost, yield, shipments, revenue and gross margin in Optical, Networking and Memory markets. Successfully released 50+ products from inception to high volume manufacturing and implemented ISO 9001 and NPI processes using PLM, SharePoint and Agile. Demonstrated ability to thrive in start-up environments and develop the full backend of semiconductor operations capabilities.Areas of ExpertiseSemiconductor Operations | New Product Introduction(NPI) | High Volume Manufacturing Ramps (HVM) | Product Engineering | Test Engineering | Bench and ATE | Inventory Management | Yield Improvement | MRAM(Fab) Technology Strategy and Execution | Package and Assembly Engineering | Supply Chain | ISO 9001 | PLM using Agile | Analytics and Data Science | Design for Test (DFT/DFX) | JEDEC/Mil/ACQ100 Std Quality and Reliability | Fab Processes | OpEx & CapEx Management | Strategic Roadmaps | Design Validation & Characterization | OSAT Management | Fab Management |Memory and Optical Market
Listed skills include Product Development From Inception To End Of Life, Eda Tools, Dft/Dfx, Hardware Architecture, and 43 others.