My passion and skills are in technology and product development, transfers to high volume manufacturing (HVM), program management, yield improvement, engineering leadership, and site management. Over the span of my career, I have delivered commendable results in flawless technology transfers, program management, yield improvement, leadership in team and site management, and employed structured methodology and program management for innovative problem solving. My creative thinking and innovative ideas translated into several cost reductions and quality improvements that have been recognized by product owners and division leadership. Senior executive leaders and my own team members have characterized my leadership as “Kugan focuses on the essentials, helps others do the same, and builds consensus while drawing out the contributions of the team; the goal of many but achievement of few”; “Kugan stands out as a conscientious leader who is able to attain impressive results. Kugan thinks about his organization's effectiveness, productivity and how he could favorably impact the company's bottom-line”; “Kugan's performance can be summarized in one word: Integrity”. • Led numerous product development, qualification, launches, transfers to HVM and scale-up• Demonstrated expertise in building and leading multi-national and cross-functional integrated teams to achieve common goals.• Proven skills in recruiting and hiring new talents, molding star performers, goal setting, managing performance, and sustaining low attrition.• Recognized ability to communicate ideas and messages at all levels, from operators to C-Suite executives.• Management and Technical Leadership in Si and Compound Semiconductor Wafer Fab, Foundry, Start-ups, Wafer Level Sort Test, Assembly/Test, Product Development, Failure analysis, Yield improvement, Consumer, Automotive and Medical devices; Robotics (HW/SW) Engineering and Prototyping; Superconductor Wire Manufacturing; Novel Packaging Technology; Program Management.• Possess disciplined transferable skills that are results oriented and execution driven.𝗦𝗣𝗘𝗖𝗜𝗔𝗟𝗧𝗜𝗘𝗦:Semiconductor Technology; R&D, Technology Development, Transfer, Scale-up and Continuous Improvement; Wafer Fab; Robotics Development and Prototyping; Superconductor Wire Manufacturing; Program Management, Methodical Problem Solving; Innovation (Out-of-the-box thinking); Quality Assurance; Engineering leadership coaching, mentoring and retention); Site level Leadership; Written and Verbal Communication.