Naveen Agrawal Email & Phone Number

Bengaluru, Ka, In

Leading Networking Server SoC ArchitectureNetworking Server SoC Architecture team is significantly senior and experienced team defining and leading next generation networking server SoCs which is catering to multiple segments of market like Networking, SASE, 5G, Storage, Edge and IOTG. Along with architecture team, also managed the development of firmware including power management, reset, boot etc. for 2 years before the team got moved to another organization due to re-org.Responsibilities – Senior Director, Silicon Design Engineeringo Leading the vector of AI adoption in Silicon design to democratize information availability and improve individual and team's productivity o Took ownership of firmware team and helped them to streamline NEX charter to solve the quality problem with the firmware. Now NEX has a dedicated firmware team for its own projects despite the team moving to different organization.o Enabled the team to continue focus on the execution and signoff quality by running active workgroups and end-2-end usecase based reviews.o Leading multiple initiatives e.g. organized the very first Org Product Day where 70 papers were submitted and the event was attended by 300+ engineers. o Led the security belt certifications where entire organization has met goals of White Belt, Yellow Belt and Security for Managers such that overall NEX in India as already met Whitebelt and Yellow belt goals!o Encouraging team members to accept challenges head on and driving brainstorming sessions to come up with better solution to solve complex problems.

SoC development for IOT BU Intel has various businesses including in Servers, Desktops, Laptops and Industrial IOT. In IOT the focus is primarily industrial customers apart from other businesses including energy, retail and surveillance. We are working on expanding Intel’s market share in these markets by introducing Edge based computing which can allow maximum control for sensors and compatibility with IA upstream servers.Responsibilities – Director, Engineeringo Joined in 2017 in HPG group, led First ever Create development of IOTG as SoC Design Manager of Elkhart Lake PCH and took it from definition to successful PRQ. o Bringing in multiple firsts to meet diverse IOT market requirements e.g. Functional Safety, Out of Band manageability, multiple TSN, dedicated offload Sensor control subsystem. o Driven a distributed execution between Bengaluru and Hyderabad teams as ElkhartLake PCH Design Manager. It is a first ever successful PCH done outside Client PCH org.o Aligned with IP ecosystem to get the features incorporated in the existing IPs and worked to define the new IPs/Subsystem for the SoCo Led SoC execution including design, DFT, Val (Simulation, Emulation & post-silicon), physical design and timing/layout convergence to ensure product meet the needs of all IOT markets.

San Diego, Ca, Us

Next Generation Modem Chip development Qualcomm is a leader in mobile technologies and to maintain the leadership, here my role is to lead the development of next generation Modem Integrated Circuit (IC/Chip) which is going to fuel the mobile growth for 3G/4G/5G upcoming markets. Our objective is to provide the best-in-class battery life while ensuring excellent user experience with our solution.Responsibilities – Director, Program Managemento Started as ICE and promoted to Director Program Mgmt. and led team of 6 PMs responsible for all Qualcomm India SoC development, customer returns debug and chipset development. o Responsible for the timely tapeout of the Modem chip, meeting it’s required PoR targets. Started with 3G and did the last SoC for 5G (First 5G tapein!). Driven 5 PRQs in 6 years! Prided myself as MDMs held unique position to hold 100% market of the most famous smartphone brand!o Ensuring smooth handoff between various teams within India and other sites of Qualcommo Create communication channel to discuss key issues, change requests and to get alignment.o Provide visibility to executive management about the status of the program execution.

Dallas, Tx, Us

1) Customer Handset Programs – OMAP34xx support (Jan 2009 – Jul 2010)Supported customer handset programs for OMAP34xx chipsets and successfully ramped High end smart phones based on Symbian and Linux, where we have enabled 720p record feature for the first time. Here I have managed the support from diversified teams situated in three continents. Helped in increasing the business engagement from one program to six programs in one year and paved the way for Android (Éclair) OS based mobile launch by an esteemed customer. First 6 years of TI provided me immense technical hand-on foundational experience on VLSI design.Responsibilities – Customer Program Managero Responsible for the successful phone ramps at customer end using TI OMAP product.o Negotiating customer requirements to ensure that their needs are met while optimizing investment from TI side.o Led development of three mobile phone programs Symbian, Linux and Android in parallelo Drive internal teams to deliver according to customer requirements.o Communicate customer view of program execution to senior management.2) SoC Program Management (OMAP) – 65nm Technology (Nov 2007 – Dec 2008)Responsibilities – IC Program Managero Responsible for the successful completion of the phase 1 of wireless multimedia accelerator full chip programo Single point of contact for various R&D teams, architects, and marketing teams spanning three different continentso Conduct periodic reviews to discuss key issues, change requests and to seek alignment.o Provide visibility to executive management about the status of the program execution.

Dallas, Tx, Us

Chip Design/Integration/Testing – 65, 90nm Technology (Apr 2004 – Nov 2007)Responsibilities –Design Lead/Integration Leado Led 12 members team to do the RTL, verification and physical design development of OMAP2 architectures in 90 nm and 65 nm technologies respectively.o Controlling the new change request, providing a plan to customers and supporting the existing silicon supporto Supported four IC development programs in two different technology nodes simultaneously.o Became MGTS in 2006 (TI’s recognized tech ladder title)o Defined the functional specification of System Level Control block.o RTL integration lead for SoC OMAP2430.

Dallas, Tx, Us

IP/Subsystem Verification and Validation (Feb 2001 - Mar 2004)Here we worked on OMAP based IP’s and subsystem where the objective was to ensure that we make India center of TI seen as Verification Center of Excellence by ensuring that there is no bug/issue found post silicon from our IP’s.Responsibilities – Module Verification Engineero Defined the RTL verification strategy of various modules in development. o Defined a flow to generate multi-threaded application snippets to emulate device usage in real circumstances.o Definition of silicon test environment and test plan.o Emulated LCD screen using National Instruments Labview and booted WinCE in pre-silicon OMAP3 using Quickturn based Palladium Emulator

Chicago, Illinois, Us

Mobility Management Layer coding for EDGE phonesHere the project was to develop a protocol stack for EDGE phones, in which my responsibility was to work in the Mobility Management Team and develop various sections of the protocol. Did testing of mobility related codebase in Edge/2.5G stack. Despite short stint of 8 months, I successfully identified bug in ETSI/3GPP specification!