Andre Labonte Email & Phone Number

Albany, Ny, Us

Albany, New York Area

GLOBALFOUNDRIES Engineering Team Manager: August 2016 – PresentProcess Engineer & Technical Lead: January, 2011 – August 2016 • Lead engineering team of R&D process engineers (etch) to excellence to provide cutting edge technical solutions to the company. Under my leadership the team increased their cross company engagement and were seen as the goto team for solving difficult dry etch challenges.• Lead a cross-functional (OPC, litho, etch, integration)… Show more GLOBALFOUNDRIES Engineering Team Manager: August 2016 – PresentProcess Engineer & Technical Lead: January, 2011 – August 2016 • Lead engineering team of R&D process engineers (etch) to excellence to provide cutting edge technical solutions to the company. Under my leadership the team increased their cross company engagement and were seen as the goto team for solving difficult dry etch challenges.• Lead a cross-functional (OPC, litho, etch, integration), multi-site team to implement five EUV levels into an existing optical-only 7nm production flow, resulting in improved yield. Eliminated fifteen optical masks and reduced cycle time by three weeks.• Lead development, within a consortium of leading global semiconductor companies, of sub 45nm EUV single expose patterning into the process flows for FinFET, Nano-sheet, and VTFET devices; with first Si functional devices.• Developed the MOL EUV-based patterning integration that was leveraged in two process technologies (FinFET & Nano-Sheets). Guided the Design-Technology Co-Optimization team to generate a successful Process Design Kit (PDK) that was used by consortium of leading global semiconductor companies as the basis of their FinFET production flows.• Developed novel solutions, based on a fundamental understanding of plasma science, for patterning challenges in the 22nm through to the 7nm technology nodes, including: Atomic-Layer Etch, Self-Aligned Contact (SAC), Merged SAC, Self-aligned gate contact, alternative replacement S/D contact, RMG and TS cut schemes, and, EUV and NTD compatible etches. Show less

So. Portland, Maine

Process Research & Development Engineer: January, 2002 – January, 2011• Successfully led etch team development on a complimentary 0.25m BiCMOS technology which included 15 integrated front-end etch steps. 1st products generated >90% gross margin.• Developed and implemented mathematical models applied to OPC, APC, and predictive modeling. Saved the company $500K, improved yield, and increased manufacturing capacity.• Led team efforts to install a Model-Based IR spectrometer… Show more Process Research & Development Engineer: January, 2002 – January, 2011• Successfully led etch team development on a complimentary 0.25m BiCMOS technology which included 15 integrated front-end etch steps. 1st products generated >90% gross margin.• Developed and implemented mathematical models applied to OPC, APC, and predictive modeling. Saved the company $500K, improved yield, and increased manufacturing capacity.• Led team efforts to install a Model-Based IR spectrometer into the FAB to monitor SOI substrate and EPI quality. Included negotiating with the vendor, coordinating resources with the vendor, coordinating the design of test structures and reticle ordering, process qualification in conjunction with operations, and training of other engineers on the tool. • Plasma etch and patterning development for CMOS, LDMOS, and Bipolar, 0.25um to 0.13um, semiconductor technologies, including DTI, STI, spacer, emitter open, extrinsic base, poly emitter, contact, poly resist, metal resistor, VIA, and passivation etches. Show less

Phd, Physics

Thesis Title: Scanning Tunneling Spectroscopy On Organic Molecules Interdisciplinary thesis project involved working with members.

Bs, Engineering Physics