Andy Carrasco Email & Phone Number

San Jose, Ca, Us

• Substrate development for high performance semiconductor packages

San Jose, Ca, Us

• Implementation of high-speed & high-density high performance packages• IO Ring planning & breakout pattern development• Package feasibility, design trade-offs & resolution• Layout productivity methodology

New Albany, In, Us

• Complex IC package design for high-speed telecommunications devices, optics-based packages, and SoC-based products• Co-design with signal and power integrity engineers• Manufacturing & assembly support, optimization, and failure analysis• New technology development for 2.5D substrate interposers• Design Review, package planning, 3D mechanical / assembly simulation• Design methodology development and package modeling/visualization

• IC Package planning, substrate design, 3D modeling, focusing on complex or difficult to design projects• Toolset & interface development to power / signal integrity tools for development of high frequency applications• Manufacturing prep, fabrication and assembly optimization of electronic circuits and assemblies

• Co-founded and helped establish company as a thought leader for the development of new technical visualization technology and product lifecycle improvements in the semiconductor industry• Developed technology roadmaps to achieve corporate strategic / financial goals and to monetize new company products• Designed, architected, and guided development of several highly acclaimed systems, including SSD (IC package mockup & planning), SSV (IC package simulation of manufacturing and assembly processes), and PCD (design software for massively large IC test products)• Successfully secured business contracts with several of the top global 10 semiconductor, OSAT (outsourced semiconductor assembly and test), and IC test companies

• Established and managed multi-national, multi-cultural software development team (Tokyo, Singapore, USA) to facilitate Design for Manufacturability initiatives at semiconductor companies• Authored and delivered technical papers at semiconductor industry events in Asia such as MIDA (Malaysian Investment Development Authority), MAP (International Workshop on Microelectronics Assembling and Packaging), ISSM (International Symposium on Semiconductor Manufacturing), and Nepcon (Electronics R&D and Manufacturing Technology Expo)• Played key role as member of technical staff to support software sales into 9 of top 10 semiconductor companies in Japan• Led international sales staff in Taiwan, Korea, and Singapore to record EDA sales in excess of $100,000 per license, with several high-end deals closed at $400,000-$500,000 per license• Oversaw excellent customer support operation in Japan and Asia, proven by AMC renewal rate over 90%

Redwood City, California, Us

• Led electronics circuit design team to successful completion of over 200 design jobs, including personally completing over 100 designs in PCB, RF, Flex, Hybrid/MCM, and IC Packaging. Particular expertise was in complex, high pin devices, mixed technologies, 3D applications, and heterogeneous packaging applications• Designed and implemented novel training curricula for highly regarded, efficient training for complex software systems• Overhauled technical support collaborative operations to achieve response times within 1 hour and solution times within 24 hours• As member of software development team, designed and architected a number of custom software development projects in close collaboration with development partners and customers• Guided internal worldwide sales team and network of international distributors to record year-on-year revenue levels• As the de-facto corporate evangelist, authored numerous articles and presented technical papers at industry trade shows such as IMAPS (International Microelectronics Assembly and Packaging Society), DesignCon, Meptec (Microelectronics Packaging & Test Engineering Council), and Semicon West

Mba, Business Administration

Bachelor Of Arts (B.A.), Architecture