Andrew Kane Email and Phone Number

Program manager of developing FOK and responsible for improvements of advanced packaging equipment. Oversaw the creation of purchase spec, supplier selection FOK delivery and creation of WP and qualification of tool. Other responsibilities include troubleshooting issues, ensuring compliance with industry standards, and driving continuous improvement initiatives. Spearheaded introduction of 6 Thermocompression Bonding (TCB) technology nodes to enable chip to substrate / wafer process technologies. Maximized equipment output, with focus on high levels of quality and compliance. Improved equipment output on all products by 10% by optimizing tool parameters. Program manager for next generation TCB, including organizing all specification request, developing new features with suppliers, and transferred the technology to 5 ATM sites worldwide, also support during Ramp and Sustaining period. Developed and implemented preventative maintenance plans, reducing unscheduled downtime. Developed robust relationships with equipment suppliers to ensure adherence to manufacturing standards Led a team of engineers in troubleshooting and resolving issues during new tool introductions

Responsible for the continuous improvement and factory support of Intel’s fleet of chip attach production equipment. Led a program that enhanced chip attach tool placement accuracy from 47μm to 13μm. Increased run rate by over 30% through innovative vision-on-the-fly program and optimization of tool movements and speeds. Implemented improvements that streamlined tool performance, contributing to significant efficiency gains.

Line engineer responsible for keeping production lines up to production. Maintained production line efficiency and quality, serving as the primary interface between operators and equipment technicians. Trained operators and addressed production issues to uphold high quality and yield standards. Progressively advanced responsibilities, leading to a role in the Development arm of Intel.