Currently responsible for a team of engineers and engineering technicians doing process development, equipment development, integration, and factory modernization within a probe card factory producing cantilever and vertical probe cards for major world-wide semiconductor manufacturers.

Responsible for managing entire production line of solar panels within Stion.

· Responsible for Thin Films daily planning of inventory flow and process development in order to meet the goal of 50% greater turns and moves, year over year, for critical lots without sacrificing cycle time for normal production.· Developed 90, 65, 45, 32nm dielectric (TEOS, SiON, Nitrides), metal (Ta, TaN, TiN), and chemical mechanical polish (Oxide, copper, and tungsten) processes for leading edge mirror-bit flash memory and AMD microprocessor technology. Transferred processes to production factories in Texas and Japan.· Project manager of Thin Films cycle time reduction team. Reduced cycle time by 40% on critical Thin Films processes and one-of-a-kind tools without sacrificing quality, throughput or increasing labor costs.· Converted Thin Films section of factory from 200mm to 300mm wafer capability by coordinating selection, installation and acceptance of new 300mm tools from Applied Materials and Novellus. Installed, qualified, and began production with all tools within 8 weeks of delivery vs. project schedule of 12 weeks.· Expert in AMAT, Novellus, Semitool, LAM, KLA, and Thermawave equipment functionality and maintenance. Wrote operations, process, and maintenance specifications and implemented proper PM schedules. Responsible for ensuring low down time with proper troubleshooting techniques in both equipment and process issues. Succeeded in having over 90% uptime on all tools.· Responsible for maintaining and continually improving usage of statistical process control (SPC) at key process steps. Utilized Kaizen problem solving techniques for continuous improvement and development activities.· Worked on team to make entire fabrication facility ISO9000 certified. Used Lean Six Sigma methodologies continuously for process improvement, defect reduction, and tool installation.

Introduced the first KLA in-line defect inspections within AMD California and developed all recipes and procedures that enabled detailed real time defect detection within the factory.Project manager for Thin Films equipment defect reduction. Achieved over 80% defect reduction on problem tools within two years.Involved in large-scale fab modernization project encompassing software modeling and implementation of the latest Applied Materials FAB300 manufacturing execution system within whole factory.Factory workflow management software expert (Workstream). Responsible for all advanced programming and functions to support uninterrupted 24/7 factory-wide computer integrated production and development.Led one year co-development project with KLA on defect data management software that reduced data analysis time by 30%.· Analyzed defects using a variety of SEM/FIB equipment and different materials analysis techniques (EDS, TXRF, ICPMS, TEM, etc) that enabled quick pinpointing of the root cause.

· Managed 12 technicians and 2 engineers in a wafer fab processing 2,000 wafers per week. Responsible for operations and maintenance of 25 Thin Films and CMP equipment sets in 24/7 high volume production. Met and exceeded quality goals of 85% process yield and low defect density. Improved productivity 25% year over year through employee cross training and cycle time reduction. · Increased tool throughput by 15% by directing engineers to improve existing processes through utilization of new tool capabilities and optimization of process steps.· Improved equipment uptime (greater than 90%) and reduced service contract costs through rigid enforcement of preventative maintenance schedules for all tools and assignment of PM ownership to specific technicians. Kept variable costs in budget (under $10 million annually).· Participated with executive team in enacting a difficult reduction in force.