Ankit Bende Email and Phone Number

Hello! As an Electrical Engineer and a Materials Scientist, I am passionate about exploring electronic materials and structures for the development of devices for novel applications such as encryption, in-memory computing, AI hardware, Flexible electronics, etc. Through my 6+ years of experience in semiconductor industry, I have gained insight into the process integration and technology development of CMOS compatible devices such as MOSFETs, MIM as well as in the areas of memory storage, neuromorphic computing and flexible electronics for IOT applications. Hardware for AI:Currently, I am pursuing Ph.D at Forschungszentrum Jülich in collaboration with RWTH University and my project involves building bio inspired analog computers for pattern recognition process or to be precise, integration of 1T-1R Memristive Arrays for Pattern Recognition through Analog Computing. Before pursuing PhD, I was a part of the team at IIT Bombay that had demonstrated country’s first indigenously developed CMOS 180nm One-Time Programmable(OTP) memory and qualified it for production at SCL, Chandigarh for Trimming application. I had also contributed in the technology development for CMOS 180nm compatible Phase Change Memories and Flash Memories for In-Memory Computation such as deep learning inference, stateful logic implementation and encryption in collaboration with SCL(Chandigarh).During my Master’s at the National Centre for Flexible Electronics, I was responsible for developing Flexible Thin Film Transistor devices for the development of flexible RF ID tags for IoT applications. Summary of my technical skills are as follows:* Hardware development for AI/In-memory computing* Process integration of CMOS compatible MOSFETs and MIM devices* Flash, OTP, RRAM Memories* Semiconductor device physics* Fabrication of semiconductor devices such as diodes, MOS cap, MOSFET etc in cleanroom (class 1000) environment* Electrical characterization of thin films and electronic devices* Structural and optical characterization of thin films