Tasks:Support for experts from development, production and quality assurance through analyzes of packaged micromechanical sensors and other electronic components;Planning, carrying out and controlling physical analyzes on components using modern special processes, e.g. B. SEM, ultrasound microscopy, EDX, focused ion beam;Preparation of packaged micromechanical sensors and semiconductor components using sections, lasers, chemistry and other methods;Assessment of the reliability of components and advice on eliminating potential risks;Investigations into degradation effects and failure mechanisms as well as development of suitable assessment guidelines;Development of failure hypotheses and analysis strategies for the localization of novel causes of defects;Support and further development of analytical procedures;

• Selecting suitable and efficient test strategies for the verification and validation of new products and solutions in vibration analysis.• Responsible for the creation of and methods for end-to-end test cases to ensure successful releases.• Designing and coordinating test activities in close collaboration with the development teams and other departments. • Agile method of working together with the development teams and other departments. • Review testing products and check the test specifications for content and testability, as well as the executed tests for plausibility and completeness.• Support the analysis and follow-up of test results with the developers and/or system architects.• Create test reports for discussions with relevant stakeholders and documentation for future development and reference.

Voltammetric Determination of Zinc Pyrithione at Bismuth and gold Electrodes

Post silicon Validation of IP's of various SOC's.