Aramis P. Alvarez Email & Phone Number

California, United States

Cupertino, California, US

• Lead flex pcb integration teams and architecture for our iPhone Pro products, ensuring seamless design and implementation across the hardware systems.
• Collaborate cross-functionally with Product Design, Manufacture Engineering, RF, PCB, and several module teams (cameras, touch/display, haptics, battery) to ensure that system solutions are integrated reliably and.
• Mentor and train new engineers in flex designs and proper layout, overseeing their progress and contributing to their development.
• Present system updates, issues, and solutions to senior executives and directors.
• Travel to Apple’s overseas suppliers to help improve test procedures and conduct root cause analysis of issues and manufacturing defects.
• Manage iPhone EE interns by leading recruitment, interviews, project assignments, and organizing guest speakers on various technical topics on a weekly basis.

Cupertino, California, US

Cupertino, California, US

Dallas, TX, US

• Group: USB Type-C / Power Delivery
• Design USB-C/PD system boards with a small form factor (2 in x 2-3 in). These designs include power tree hardware block diagrams, calculations, component selection, schematics, PCB Layouts (Altium), and board bring-up.
• Design PCB Evaluation Modules (EVM’s), which includes creating the EVM user’s guide, and writing the application section of the datasheet for our USB-C/PD device portfolio.
• Support customers using TI’s USB Type-C/PD Controllers via TI’s technical engineering forum (E2E), hardware debugging, schematic and layout reviews, circuit component calculations.
• Set up events, delivered career focused presentations, and recruited/interviewed students at the University of Michigan for Texas Instruments.
• Past support: positive and negative high voltage hot-swap controllers and designed an EVM for one of TI’s hot-swap controllers (Sept. ’16 thru Sept. ’17).

Dallas, TX, US

• Hired into the Global Application Rotational Program with TI. There are two rotations throughout the program: Analog Apps with a Product Line (Factory), and working with TI customers to solve their engineering problems.
• Led a tear-down on existing smart lock products to architect a solution using TI products. Underwent an in-depth analysis on different power topologies to propose a differentiated solution based on power calculations.
• Designed the schematic and segments of the layout including parts placement and routing analysis, for the smart lock project enabling 5+ years of battery life, and authored the design guide (TIDA-00757). The schematic.
• Co-authored a white paper titled, "Extending battery life in smart locks". This high-level paper summarizes different power architectural approaches and which is best for reducing standby power consumption. Field.
• Assisted distribution for Space Micro requirements and needs (20 units, ~$1.2M), helped develop a system block diagram and assisted with schematic reviews while driving support from the product line
• Went above and beyond for Qualcomm by conducting timely schematic and layout reviews, without resourcing the BU, by diving deep technically and researching collateral about the device in question.

Dallas, TX, US

• Group: Analog Motor Drivers
• Researched and pitched the purchase of a 3D printer through a team-facing presentation that allowed for a real-life demonstration of TI’s motor driver potential
• Reverse-engineered the stepper motor drivers on a 3D printer for the Motor Drivers Business Unit in order to integrate Texas Instruments electronics
• Supported field and factory engineers through board layout development, EVM testing, and BoM generation

Dallas, TX, US

• Worked with and reported regularly to team located in Sunnyvale, CA while stationed in Dallas
• Created a Received Total Wideband Power (RTWP) module implemented on a FPGA (Kintex 7)
• Designed the algorithm for the RTWP in VHDL using a data-path block and controller scheme

Gainesville, Florida, US

• Contacted multiple recruiters from industry and hosted 13 Info Sessions in the Fall semester, an IEEE record, and 9 Info Sessions in the Spring
• Restructured the organization into a two level org. tree where each Executive Board member (i.e. Pres., Vice Pres., Treasure, and Secretary) had specific responsibilities, as well as manage and direct 4-5 IEEE chairs.
• Seamlessly ran one of the biggest engineering societies at the University of Florida
• Had bi-weekly meetings with the ECE chair and helped the department with special events

Santa Clara, California, US

• Ran tools to meet timing, noise, and quality specs on my Functional Unit Block (FUB)
• Part of the Compute Component Development Organization (CCDO) execution team working on the Haswell processor
• Performed multiple Formal Equivalence Verifications (FEV) to assure the RTL and Netlist implementation are logically equivalent

Ann Arbor, Michigan, US

• Highly selective summer program designed to prepare undergraduates for graduate study through intensive research experiences with faculty mentors
• Worked with Dr. Michael P. Flynn and designed a delay cell using 32 inputs of double tri-state inverters with an average of 55 ps propagation delay. The 32 inputs (enable inputs) were then connected to a 5:32 decoder.
• Presented my research at a concluding conference in roundtable format, created and presented a professional poster at a scientific research symposium, and filmed a YouTube video of my project

Master Of Science (M.S.), Electrical Engineering

Bachelor Of Science (B.S.), Electrical Engineering