Allen R. Email & Phone Number

Texas, United States

Migdal Haemek, Israel, Il

Lowell, Ma, Us

Provided manufacturing support to InP based 100-GHz Avalanche Diodes. Process owner for Metalization, CVD, Etch and Metrology. As the SPC owner, implemented advanced SPC for monitoring fab metrics. Planned and supported advancing Lithography roadmap with the acquisition and implementation of new tools.. Worked with the cross functional team and Sr. Managers to fine tune manufacturing goals for improving Yield and reducing defects.

Burgess Hill, West Sussex, Gb

Provide Application and Marketing support to IBM, GlobalFoundries, MIT, .....

Member of Characterization Team, supporting development and production of bulk 4-8 inch wafers for WBG electronics.

Malta, Ny, Us

• Support advanced Technology Development, focused on DY characterization, with ownership of FEOL/MOL process sector for 28nm, 14nm and 7nm technology nodes.• Successfully developed a new mass metrology method for the first time in Fab8, to accurately assess CD/OV/EPE for improving pattern fidelity on sub 7nm and 14nm technology nodes. • Project engineer for 4 new Metrology tools/methods that revolutionized the Pattern Fidelity, holistic Metrology, PDF metrology, eBeam scan strategies.• Proactively monitor defectivity, collaborate with process modules and integration team to plan and execute Yield improvement projects and implemented solutions on schedule.• Support and maintain methodologies for technology transfer, publish and present reports to internal customers and in external journal.• Successfully engaged with tool suppliers to evaluate new tools and solutions for development and manufacturing of advanced technology nodes.

Rehovot, Il

• Reporting directly to senior manager, planned and coordinated project activities with Applied Materials, Lam research in development of 300mm and 450mm OCD metrology solution.• Collaborated with Nova engineers in development and introduction of new products and addressed issues related to current products. • Main liaison between Nova and Technology partners, monitoring performance of tools and presented analysis of field data to customers, marketing and development team. • Completed extensive field assignments providing OCD Metrology solutions to advanced semiconductor Fabs such as GLOBALFOUNDRIES, Samsung, Micron, Albany Nanotech, Applied Material and Lam.

Milpitas, Ca, Us

LITHOGRAPHY PROCESS ENGINEER:• Sustained and managed production process for Uncooled Bolometers.• Researched and compiled Yield analysis data, implemented inspection and advanced SPC methods and took immediate actions to minimize Yield barriers • Implemented process and methods that contributed to improving yield by more than 50%.• Successfully evaluated and qualified multiple Masks and Photoresist/chemicals and supported development of new IR image sensors.

Centennial, Colorado, Us

Customer Support Engineer (e-beam)• Provide support for the eS32 ebeam inspection tool.• Drove hardware and process related issues to resolution on timely manner.• Initiate proactive action on behalf of the customer.• Research and supply analysis of field data and tool performance data to engineering and marketing.

Seoul, Kr

LITHOGRAPHY PROCESS ENGINEER:• Sustained and managed ownership of multiple process layers and Polyimide section on daily basis and took pride working in one of the most challenging Fab in the country. • Collaborated with Korean engineers to transfer new product to Austin production line. • Supported manufacturing and Yield Engineering group in improving process flow and enhancing yield performance.• Implemented throughput project to reduce process time, resulted in improving cycle time in parallel with commitment to daily operation.• Teamed up with Metrology engineers, researched and established a new standard for calibration and monitoring of SEM tools to maintain tight control over critical CD measurement.

Austin, Texas, Us

LITHOGRAPHY PROCESS ENGINEER:• Sustained operation of the MOS6 photo process section on daily basis. • Lead and managed ownership of FEOL, MOL process steps and worked with team members to identify and reduce rework levels. • Applied advanced SPC methods to Collect, Monitor and Control charts for tools and process. Implemented matching scheme for first print layer and rearranged subsequent photo layers to improve CD and Overlay accuracy. Implemented throughput project which resulted in net gain of 25% in productivity.• Presented photo process improvement project at Annual Motorola forum and received recognition award for accomplishments. • Collaborated with MOS6 team and received recognition award for successful transfer of technology to sister Fab in France.

APPLICATIONS ENGINEER/PROJECT LEADER:• Working directly with regional manager, planned and coordinated application engineering activities for 200mm production lines and development of 300mm R&D line in Keihung Fab• Performing in matrix management organization took full responsibility to introduce full line of ASML products and options to Korean customers and successfully planned and executed 52-field implementation projects in parallel in less than 6 months. • Conducted diagnoses and analysis of process and equipment related issues and offered resolutions in a timely manner. • Worked with Korean field engineers and customers to develop methods to enhance and optimize performance and productivity of the Steppers and Scanners.