Giving back in yet a different way. Hope to influence young minds to be better scientists and engineers.

Ecstatic about the opportunity to influence young minds into the excitement and wonder of science.

Developed new processes and laser optics/tool improvements for laser metal 3D additive manufacturing sector.

Worked on process, integration, and yield improvements for SMRT cell technology and manufacturing used for DNA sequencing using PacBio ZMW technology (zero mode waveguide).

Accomplished semiconductor process engineer and senior manager providing consulting services in:• Thin film characterization and chemistry using electron and optical spectroscopy• Process Integration, process development, and yield enhancement• Vacuum Technology, PVD, CVD, etch equipment & process• Lithography and Metrology. Mask design and DFM.• Statistical Data Analysis and Design of Experiments• Advanced ellipsometry and modeling at Stanford Nanofabrication Facility

Responsible for the development, optimization, and transfer of CBRAM technology from lab scale university research projects to viable production-worthy semiconductor processes at advanced nodes. • Recruited and trained engineers, managers, and technicians, created and managed budgets, and directed process development and qualification at several Tier 1 CMOS facilities.• Reported plans and technology accomplishments to the Board of Directors and the executive committee. • Responsible… Show more Responsible for the development, optimization, and transfer of CBRAM technology from lab scale university research projects to viable production-worthy semiconductor processes at advanced nodes. • Recruited and trained engineers, managers, and technicians, created and managed budgets, and directed process development and qualification at several Tier 1 CMOS facilities.• Reported plans and technology accomplishments to the Board of Directors and the executive committee. • Responsible for tape out and fabrication of all technology vehicles. Demonstrated a contamination free barrier technology to gain acceptance and introduction of non-standard materials into CMOS fabricators.• Developed strategies and vital contacts for the failure analysis and subsequent integration improvements for a novel resistive CBRAM technology, often having to create new methods or tool improvements and standards. Implemented and maintained statistical process control methodologies for new materials.• Initiated an executive patent committee and managed the filing of intellectual property in the company.• Author and contributor for company white papers, patents, publications, and conference presentations. Show less

• Developed a 1MB molecular electrochemical memory chip and managed the processing of test wafers at a fab in Taiwan and BEOL processing at our local laboratory process facility.• Supervised recruiting of engineers, technicians, and researchers, created and managed budgets, and directed process lab fabrication. • Designed process clean room, installed and certified tools, and initiated statistical process control protocols. • Directed and supported the technology transfer of… Show more • Developed a 1MB molecular electrochemical memory chip and managed the processing of test wafers at a fab in Taiwan and BEOL processing at our local laboratory process facility.• Supervised recruiting of engineers, technicians, and researchers, created and managed budgets, and directed process lab fabrication. • Designed process clean room, installed and certified tools, and initiated statistical process control protocols. • Directed and supported the technology transfer of processes from university research to viable semiconductor processes and demonstrated the feasibility of molecular charge storage as a memory device. • Collaborated with industry tool leaders in the semiconductor division to develop new critical tools. Facilitated the transfer of the technology to a sister facility pilot production line. • Developed a novel in-situ ellipsometric analytical technique to study sub-monolayer chemistry and fail mechanisms.• Served as a member of the patent strategy executive committee, generating, filing, and protecting intellectual property. • Established a ‘manufacture friendly’ culture amongst university researchers to prevent unlikely or prohibitively expensive materials or process methods to transfer projects into high volume production. Show less

Consulting Engineer and Lead Integrator, Advanced DRAM and Flash NAND ProductsServed as a technical program consultant to the company president. Transferred technology from R&D centers to the manufacturing of advanced DRAMS and Flash NAND Memory. Collaborated with R&D and manufacturing plants and tool suppliers in Japan, selecting the tools, methods, and processes and help reconcile the differences between U.S. and Japanese standards and methods of operation.Senior Manager, New… Show more Consulting Engineer and Lead Integrator, Advanced DRAM and Flash NAND ProductsServed as a technical program consultant to the company president. Transferred technology from R&D centers to the manufacturing of advanced DRAMS and Flash NAND Memory. Collaborated with R&D and manufacturing plants and tool suppliers in Japan, selecting the tools, methods, and processes and help reconcile the differences between U.S. and Japanese standards and methods of operation.Senior Manager, New Products and Technology Managed the technology transfer and manufacturing development and ramp for advanced memory products, including advanced DRAM and NAND Flash Memory for IBM, Toshiba, & SanDisk. • Achieved on time, on budget, and record yields in new product introduction into HVM production.• Contributed to the company’s success and constantly exceeded standards of excellence; rewarded as the first Dominion Semiconductor employee to be promoted to Senior Technical Staff Manager.• Responsible for the technical transfer and qualification of Flash NAND product to FlashVision, a new company partnership between IBM, Toshiba, and SanDisk. Show less

Supervised fabricator start-up, planning, tool procurement, and recruiting. • Built and managed a technically diverse team of 19 lithography engineers and technicians that accomplished the installation and qualification of over 60 photolithography and metrology tools with a start-up budget of over $400M. Completed projects on time and budget constraints to meet fab ramp up schedule. • Executed a companywide process training program designed to reduce scrap and improve operator… Show more Supervised fabricator start-up, planning, tool procurement, and recruiting. • Built and managed a technically diverse team of 19 lithography engineers and technicians that accomplished the installation and qualification of over 60 photolithography and metrology tools with a start-up budget of over $400M. Completed projects on time and budget constraints to meet fab ramp up schedule. • Executed a companywide process training program designed to reduce scrap and improve operator understanding of methods vital to increasing profits and turnaround time. • Acted as a technical consultant to the University of Virginia in a National Science Foundation grant to create an interactive educational video for lithography and etch operators.• Selected by IBM and Toshiba executives to serve as one of the first managers of Dominion Semiconductor. Responsible for transfer of the entire photolithography and metrology process and tool sets Show less

Implemented and developed processes for first generation DUV lithography tools and resists at IBM’s Advanced Semiconductor Technology Center. • Worked with vendors to evaluate and improve new tools and techniques for emerging DUV lithography.• Served as lead process integrator for IBM and Infineon’s 64 MB Advanced DRAM joint development effort. Supervised split lot travelers, and worked with test engineering groups to evaluate critical split lot experiments.• Representative on IBM’s… Show more Implemented and developed processes for first generation DUV lithography tools and resists at IBM’s Advanced Semiconductor Technology Center. • Worked with vendors to evaluate and improve new tools and techniques for emerging DUV lithography.• Served as lead process integrator for IBM and Infineon’s 64 MB Advanced DRAM joint development effort. Supervised split lot travelers, and worked with test engineering groups to evaluate critical split lot experiments.• Representative on IBM’s strategic equipment council and selected next generation advanced lithography and metrology production tools for a high volume wafer fabricator. • Served as a member of IBM’s patent review board; advised senior management and attorneys on potential influential and revolutionary concepts. Show less

Selected to participate in a project at the prestigious T J Watson Research Center. The project achieved international recognition for a sub-Class 1 facility with full automation and SMIF mini-environments in pilot line fabrication and was selected a Sematech benchmark site. • Served as project manager to transfer process learning and improvements to IBM’s packaging manufacturing lines, which improved next generation product introduction. • Supervised lithography, metal… Show more Selected to participate in a project at the prestigious T J Watson Research Center. The project achieved international recognition for a sub-Class 1 facility with full automation and SMIF mini-environments in pilot line fabrication and was selected a Sematech benchmark site. • Served as project manager to transfer process learning and improvements to IBM’s packaging manufacturing lines, which improved next generation product introduction. • Supervised lithography, metal deposition, and plasma etching processes for novel substrate modules, which resulted in thin film wiring structures capable of meeting next generation computer speeds.• Created patterning processes for multi-layer ceramic packages using novel low stress photo-definable polymer materials. • Established feasibility and demonstrated a high temperature, low loss, optical waveguide technology. Developed a direct-write tool demonstrating viable wave-guides for the optical coupling of external clocks. Show less