Serving as core for hardware design by designing custom QSFP Module backshell, compliant connectors, and PCB thermal relief in Solidworks to accommodate company's transition to a new PCB designs, electrical and optical adapter hardware, and thermal requirements. Conducting thermal analysis including PCB IR drop and impedance simulations using Keysight SIPro and PIPro and Ansys Icepak. Simulating chip junction and PCB temperatures for EVBs and platform development to improve thermal management strategies. Designing and assembling custom hardware to improve lab automation and assist in transfer of lab automation infrastructure to additional lab location to enhance efficiency and productivity.

Developing software/hardware solution to eliminate period poverty. Worked on design of website and app as well as using Solidworks to design hardware solution. Produced 3 prototypes using 3D printing and laser cutting. Also worked on electrical circuit design and programming for inventory tracking using microcontroller, adafruit, and IoT technology. Presented solution to as part of UC Berkeley NAF Future Ready Scholars Speaker Series, participated in Berkeley entrepreneurship track including Student Entrepreneurship Program 2023 Cohort, UC Berkeley Health Tech CoLab, and Jacobs Institute Innovation Catalysts Ignite Grant Fall 2022 Cohort.

Developing electronic shoe to prevent slips for active elderly and warehouse workers. Wrote code for controlling actuation of ak60-6 v1.1 motor using CAN BUS communication for ankle actuation. Researched ESP-32 models to match Bluetooth, Wi-Fi, and software specifications and possible software compatibility (ex. ROS, MATLAB Simulink). Conducted patent research for referenceable technology and to ensure no infringement on prior patents.

Providing feedback on homework regarding energy technology and policy for a class of 100+ students. Obtained position for demonstrated excellence on the subject matter in previous semester.