Coordinate potential employee interviews; Schedule and perform company orientations; OSHA, MIOSHA and safety training; Training and certification of employees to IPC-A-610 F and J-STD-001 rev F criteria for assembly and manufacture of electronic assemblies.

Orientate new employees, set up training classes using IPC 610 and J-STD-001 criteria for electronics assembly. Teaching of acceptable techniques of surface mount and through-hole soldering using IPC 7711/7721 criteria. Testing and IPC certification of qualified technicians.

Repair PCB level damage per IPC 7711/7721, remove/replace all packages of plated through-hole and SMT components. Excellent knowledge of FPGA, LGA and BGA rework methods and equipment. Extensive use of microscope and x-ray equipment. Applied knowledge of IPC-A-610 and J-STD-001 in regards to acceptability criteria. Trained new employees advanced soldering techniques (ie fine-pitch, pad and trace repair, pcb reconstruction)

Supervised a turnkey assembly workcell assembling Hewlett Packard printer mainboards, consisting of 25 people. Workcell process included SMT operators, SMT solderers, manual assembly, wave solder, cleaning, post wave inspection/rework, ICT, FVT and Final Inspection.