Process Engineering/production

Work Description/Responsibility: · Assist engineer to setup new product and device. · Troubleshoot and repair hard down equipment· Leader for shift technician· Perform machine restoration for new device and preventive maintenance.· Handling ASM AB339,Eagle 60,Eagle 60Ap & Harrier. ESEC (All Wire Bonder MC)· Works on manufacturing technical support assignments with clearly defined objectives & performs duties which are routine in nature, using prescribed procedures.· Troubleshoot, repair, calibrate and carry out routine preventive maintenance (PM) on a wide range of automated/semi-auto assembly equipment.· Perform MPM Activity by Monthly, well known in calibration, Wire clamp, Bond force, 91 steps & TVCAccomplishment.· Improve wire bond die pr stoppages for 7000ppm to 3800ppm. · Improve S08 - Eagle 60 damage strip from 5 case/week to zero cases.· Support 1st bond false alarm reduction by perform machine health check & provide all the problematic device information.· Change AB339 side light from bulb type to led with cost saving impact RM200 per machine.· Support blue led installation to minimize die pr issue.· Support machine restoration for Merlot Device

Work Description/Responsibility: · Assist engineer to setup new product and device. · Troubleshoot and repair hard down equipment· Responsible on Copper wire equipment setup (Wire Bond)· Responsible on equipment spare part.· Trainer for new hire technician.· Deal with vendor for fabrication and modification.· Supervisor for shift technician Accomplishments· Improvement Item : KNS Connx Heater Plate Modification (NSOL , B'Wire problem improvement) Detail : Add additional copper plate underneath the heater plate Objective : 1- To make heater plate fully contact onto the heater base 2- Improve evenness of the heater plate temperature, thus improve bond ability. · Improvement Item : KNS Connx QFN Window Clamp modification (Reduce conversion time) Detail : Standardize the window clamp thickness which is benchmark with SOIC window clamp thickness Objective : Reduce conversion time from 40minutes to 30 minutes due to no need to perform EFO holder alignment and prevent EFO holder damage due to misalign issue· Improvement Item : ASM Extreme Universal Heater base (Reduce conversion time) Detail : Modified QFN heater plate (8mm) portable with SOIC heater base (7mm) Objective : To reduce package conversion time 2hours to 45 minutes (QFN to SOIC/SOIC to QFN) due to no need to change heater base.

Work Description/Responsibility:· In charge of Case Assembly Process (One of the process for IGBT production). Case assembly include process below : a) Solder Paste Application b) Silicon Glue Application c) Module Press d) Case Wash e) Inline Inspection f) Gel Injection g) Gel Curing h) Hot Isolation Test i ) Lid Assembly j ) Laser Marking· Setup new line (Package, Device, Manufacturing Line). · Responsible for new tech hiring.· As a trainer for Case Assembly Process.· Perform process check for case assembly process such as temperature profile check, gel hardness check.· Responsible for Case Assembly Working Procedure.· Troubleshoot and repair down equipment · Handle product quality issue (Low yield and customer feedback/return)· Setup new production line, new package and new production line qualification ( Equipment line up, process check, working procedure, customer sample) Type of equipment that I able to handle independently are: 1. Musashi Shootmaster 300 (Solder and Glue Application)2. Module Press indexer3. Cleanvy Case Wash4. Naka Liquid Gel Injection5. Gel Curing Indexer