Baldev Raj Email & Phone Number

• IQC: Inspection of incoming material like Silicon Wafer, Substrate (PCB) Die attaches paste, Epoxy mold compound. Pen Drive casing, Blister, catton,inlay card• IPQC: Product inspection during process at various stages like SMT, Laser marking, De-penalization, F1 & F2, Ultrasonic welding, Casing, Sealing & Packaging. • Responsible for reverse engineering (Package engineering) of chip on board (COB), QFN, TSOP, LGA semiconductor packages.• Expert in failure analysis for semiconductor packages like COB, QFN, TSOP etc using X-Ray, SAM (Scanning acoustic Microscopy), De-capsulation and bond testing (Cratering).• Production Benchmarking of new products in solid state media like Micro SD, SD cards and Pen drives.• High reliability testing (Electrical, Environment & Mechanical) of solid state media products.• Involved in new product qualification & new process qualification. • Regular Periodic Review and Reporting of Quality Performance and Monitoring.• Root cause analysis of line defects, initiate corrective and preventive actions for the same.• Improvement in product and process by conducting regular product and process audits.• Maintaining 5S activities.• Ensure the systems being followed on the shop floor approve product and process deviations.• Ensure incoming material checking & online checking in the process. • Using all type measuring instrument like venire, Micrometer, Dial indicators etc gauge. • Member of the SMT ( self Management term ) production increase, low cost production

Listed skills include Engineering, Sales Management, Process Improvement, Change Management, and 13 others.