Weldon Beardain Email & Phone Number

Plano, Texas

Introduced more than 150 logic products in the 74AUP1Gxx 74LVC1G / 2G and 74AHC/T1G logic families. The single and dual gate logic are available in 1.0mm x 1.0mm X 0.4 mm packages. The product is less expensive and mechanically more robust than chip scale alternatives. A second wave of 74LVCxx products has also been introduced that includes the most.

Senior Analog Design Engineer experienced in BiCMOS and Bipolar analog circuit design. Working knowledge of semiconductor device physics aiding in the troubleshooting of designs or identification of modeling issues. Extensive experience in Analog Product Engineering dealing with the production test and packaging of analog integrated circuits. Key.

• Successfully designed high volume commodity analog products with circuits including mirrors, bandgaps, comparators, op-amps, and small state machines. Provided technical support to other designers and marketing though.
• Designed BQ2439X family of low power USB Battery Charger detection circuits for cell phones on a BiCMOS process while working with the end customer to negotiate final specifications. Parts are used to identify type of.
• Designed TPS228XX Voltage programmable LDOs and load switches optimizing the customers need for LDO accuracy and low load switch resistance while achieving the lowest practical cost..
• Redesigned and repaired TL347X bipolar op-amp family that was subject to sporadic yield excursions. Reviewed the device physics of the 30 volt lateral PNPs and optimized the tradeoff between early voltage and.
• Reverse engineered over 100 competitor products supplying data to support the efforts of a design team dedicated to making second source catalog products. Voltage references, LED drivers, LDO’s, switching regulators.
• Resolved customer application support issue for bipolar TL347X op-amps with circuit improvements centering common mode ranges and alleviating power up issues retaining sales.

• Managed and mentored a team of engineers and technicians that provided product engineering support for wide range of Analog Military Components meeting Mil Std 883 and class V criteria.. This included op-amps.
• Established Military analog test and assembly capability for a product line acquired from Unitrode. This involved the securing of an LTX TS88 and the coordinated construction and procurement of 65 test sets.
• Represented TI at Automotive Electronics Council as a expert in the production of known good die and received the best paper award. Patented a number of die handling techniques..
• Negotiated contract for an Ada complier for the TI C6X DSP family.
• Coordinated engineering effort to supply wafers used by DSEG (Texas Instruments Defense and Electronics Group) and DRS in night vision applications. Supplied wafer electrical test data to DSEG product engineers.

• Compiled details of TI Military Modules and Digital Signal Processors and made technical presentations to customers. During the late 80’s the TI C40 DSP was one of the most powerful FFT computing elements in the world..
• Won contract to place Dual C40 MCM’s in Hughes/Raytheon RAM missile.
• Redesigned TI DSP multi-chip modules for improved reliability and ease of production. Reduced cost of production by over 40 per cent by securing capital for assembly equipment to move MCM assembly from subcontractors.
• Technical liaison between TI and Tartan labs for the procurement of Ada for TI DSP products. Made joint customer calls with Tartan representative to promote TI DSP’s and Tartan Ada products.

Electrical Engineering

Solid State Electronics and Device Physics. Computer Architecture and Digital Systems

Bs, Physics

Activities and Societies: Computer Club, American Chemical Society,