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Jerry Beckmann Email & Phone Number

Electrical Engineering Manager at Amazon Project Kuiper
Location: Seattle, Washington, United States 16 work roles 1 school
1 work email found @audience.com LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

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Current company
Role
Electrical Engineering Manager
Location
Seattle, Washington, United States

Who is Jerry Beckmann? Overview

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Quick answer

Jerry Beckmann is listed as Electrical Engineering Manager at Amazon Project Kuiper, based in Seattle, Washington, United States. AeroLeads shows a work email signal at audience.com and a matched LinkedIn profile for Jerry Beckmann.

Jerry Beckmann previously worked as Electrical Engineering Manager at Amazon Fulfillment Technologies & Robotics and Flight Deck Integration Lead at Boeing. Jerry Beckmann holds Bachelor Of Engineering (Be), Computer Engineering from Illinois Institute Of Technology.

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Email format at Amazon Project Kuiper

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{first_initial}{last}@audience.com
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AeroLeads found 1 current-domain work email signal for Jerry Beckmann. Compare company email patterns before reaching out.

Profile bio

About Jerry Beckmann

Jerry Beckmann is a Electrical Engineering Manager at Amazon Project Kuiper. He possess expertise in embedded systems, firmware, product development, embedded software, asic and 12 more skills.

Listed skills include Embedded Systems, Firmware, Product Development, Embedded Software, and 13 others.

Current workplace

Jerry Beckmann's current company

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Amazon Project Kuiper
Amazon Project Kuiper
Electrical Engineering Manager
Seattle, WA, US
AeroLeads page
16 roles

Jerry Beckmann work experience

A career timeline built from the work history available for this profile.

Electrical Engineering Manager

North Reading, Ma, Us

Responsible for hiring an electrical team to grow and support the organization goals and build the infrastructure needed for PCB design.* Lead electrical engineer on Assisted Bagging. A new concept to assist workers with putting multiple items into a single bag. Effort led to an increase of 15% efficiency from the initial alpha design (verified over Amazon Prime Day). Design came in under budget by 40% of target.* Supported an effort at a new conveyance concept, utilizing linear synchronous motor (LSM) and wireless power technologies. Successful proof of concept demo to leadership.* Sponsored and mentored an intern to investigate using open-source simulation tools (ElmerFEM) for thermal, power and signal integrity analysis of PCB.

Jan 2024 - Sep 2024

Flight Deck Integration Lead

Arlington, Va, Us

May 2023 - Jan 2024

Manager Systems, Electrical, Embedded And Test Engineering

Seattle, Wa, Us

Oct 2022 - Mar 2023

Electrical Engineering Manager

Seattle, Wa, Us

* Lead an electrical team responsible for sensor integration, compute, wireless, propulsion, battery and charging infrastructure.* Lead the architecture of a second generation, reducing cost by over 50% and increasing compute capabilities.

Jun 2019 - Nov 2022

Director Hardware Systems

Mountain View, Ca, Us

* Lead international multi-disciplinary team to develop a new platform for strategic sector of BlueTooth headsets. The team included members from hardware, firmware, DSP, algorithm, mechanical, tools, support and external contracting resources.* Visited key customers in the industry to discuss product architecture and needs to align future technology roadmap.* Managed annual budget of $500K and was consistently within 5% of target spending for the year.

Feb 2016 - Jan 2019

Sr. Manager Hardware Systems Engineering

Mountain View, Ca, Us

* Managed an international team of hardware, firmware and FPGA engineers.* Implemented Orcad\Allegro library to use CIS database for part management using MS Access and Python scripts.* Oversaw company needs for hardware including laboratory equipment, development boards and internally developed hardware.* Owned ISO process for the hardware team and engineering laboratory functions.* Site administer and company advocate for Atlassian Confluence and Jira.

Feb 2014 - Feb 2016

Manager, Hardware Engineering

Mountain View, Ca, Us

* Hired and managed multi-discipline team of hardware, software, FPGA, characterization and laboratory functions to support Audience worldwide hardware needs.* Consistently delivered hardware needs on schedule and within budgetary guidelines.

Feb 2011 - Feb 2014

Senior Hardware Engineer

Mountain View, Ca, Us

* Architected and developed 2nd generation of mixed signal hardware platform for supporting Audience technology utilizing a Xilinx Spartan 3A FPGA for advanced features and Texas Instruments MSP430 for programmatic control over hardware platform. The platform has been in use for 8 years with no major updates.* Developed a PERL/Python scripting environment, integrating National Instruments LabView controls to automate testing for silicon bring up.

Jan 2010 - Feb 2011

Applications Engineer

Mountain View, Ca, Us

* Revamped internal software tools for efficiency in troubleshooting customer problems.* Created test plan and executed bring up of custom ASIC.* Used Audio Precision, Tektronixs Oscilloscope and Logic Analyzers to trouble shoot analog and digital circuit problems in cell phones.* Authored applications notes around common customer issues including power optimization, hardware filters for analog audio and API command sequencing.

May 2008 - Jan 2010

Firmware Engineer

San Jose, Ca, Us

* Maintained C code base for existing product line of haptic technology* Ported firmware to Cypress, Renesas, Freescale and custom ASIC* Re-architected firmware for ease of portability across multiple microprocessors.* Created build scripts to automate release process using PERL and Ant.

Sep 2007 - May 2008

Manager Applications Engineering

San Jose, Ca, Us

* Technical member of team for evaluating startups for investment or acquisition.* Developed new process for team integrations with Micron development flow* Worked with partners in Taiwan to develop innovative new storage products for consumers.* Managed team of engineers responsible for product definition, implementation and support.* Developed next generation FPGA NAND flash controller using PCIe front end for 200MB/s sustained data throughput.* Developed FPGA test harnesses for qualifying 3rd party ASICs and NAND flash technology to evaluate throughput and ECC algorithm (BCH and Reed-Solomon)

Jan 2006 - Sep 2007

Sr. Applications Engineer

San Jose, Ca, Us

* Develop new products combining Lexar Media’s core technology with innovative new technology. New products included the Lexar Media TouchGuard, and Lexar Media Secure Drive.* Evaluated, recommended and integrated new technologies into the USB product line. Technologies included biometric sensors, GPS solutions, eInk displays, near field communication (NFC) and portable media players (PMP).* System architect on JD Touchguard and JD Mercury products.* Managed development relationship with Taiwanese controller vendor.* Authored product requirements documentation and data sheets.* Used PADS PowerLogic for schematic creation and PCB layout verification.* Debug system level problems using logic analyzers, bus analyzers, and oscilloscopes for CompactFlash, SD, MMC, and USB.

Apr 2004 - Dec 2005

Lead Developer Support Engineer

San Jose, Ca, Us

* Represented team at internal product core teams as voice of the customer.* Worked with manager to provide criteria for hiring and lead interviewing teams.* Supported marketing as technical evangelist of the API.* Worked with Education department on developing an API class for partners.* API integration for Sun, EMC, HP, Dell, Veritas using C/C++, Java and PERL on Solaris, HP-UX, Linux and Windows.* Co-developed code for partner’s applications including HP OpenView, Sun Metropolis 2.0, and EMC Control Center SAN Manager.

Aug 2000 - Apr 2004

Staff Engineer

Triad Controls

* Developed Die Sensor Protection System using a Motorola 68000 controller implemented in assembly.* Ported a Linux 2.2.4 kernel to run from M-Systems Diskonchip and AMD Elan microcontroller with atouch screen display and numeric keypad user input for future products.* Converted existing infrared sensor board to single Altera MAX7128 using VHDL including schematicredesign, and PCB layout using PowerLogic to achieve a BOM reduction and higher reliability.

Aug 1999 - Jul 2000
1 education record

Jerry Beckmann education

  • Illinois Institute Of Technology
    Illinois Institute Of Technology
    Computer Engineering
FAQ

Frequently asked questions about Jerry Beckmann

Quick answers generated from the profile data available on this page.

What company does Jerry Beckmann work for?

Jerry Beckmann works for Amazon Project Kuiper.

What is Jerry Beckmann's role at Amazon Project Kuiper?

Jerry Beckmann is listed as Electrical Engineering Manager at Amazon Project Kuiper.

What is Jerry Beckmann's email address?

AeroLeads has found 1 work email signal at @audience.com for Jerry Beckmann at Amazon Project Kuiper.

Where is Jerry Beckmann based?

Jerry Beckmann is based in Seattle, Washington, United States while working with Amazon Project Kuiper.

What companies has Jerry Beckmann worked for?

Jerry Beckmann has worked for Amazon Project Kuiper, Amazon Fulfillment Technologies & Robotics, Boeing, Amazon, and Knowles Intelligent Audio.

How can I contact Jerry Beckmann?

You can use AeroLeads to view verified contact signals for Jerry Beckmann at Amazon Project Kuiper, including work email, phone, and LinkedIn data when available.

What schools did Jerry Beckmann attend?

Jerry Beckmann holds Bachelor Of Engineering (Be), Computer Engineering from Illinois Institute Of Technology.

What skills is Jerry Beckmann known for?

Jerry Beckmann is listed with skills including Embedded Systems, Firmware, Product Development, Embedded Software, Asic, Debugging, Soc, and C++.

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