Senior Process Engineer
Current- Identified root cause of repeated surface defects through extensive data analysis, improving wafer process yield by 5%.
- Reduced downtime of edge polish machines by 10% through pad wear improvements and life extensions.
- Developed numerous JMP scripts, including the extraction of point-defect information from raw inspection data to streamline process troubleshooting.
- Lead development of numerous process applications in C++, C#, and Python, including neural network models for automated image pattern recognition.