Ben Yang Email & Phone Number
@163.com
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Who is Ben Yang? Overview
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Ben Yang is listed as Director, Adv. Moudle Development and TD at SiEn(QingDao) Intergrated Circuits Co.,Ltd., based in Inner Mongolia, China, China. AeroLeads shows a work email signal at 163.com and a matched LinkedIn profile for Ben Yang.
Ben Yang previously worked as Director, Adv. Moudle Development/TD at Sien(Qingdao) Intergrated Circuits Co.,Ltd. and 副所长 at 国电投中央研究院. Ben Yang holds Doctor Of Philosophy (Phd), Materials Science from Shanghai Jiao Tong University.
Email format at SiEn(QingDao) Intergrated Circuits Co.,Ltd.
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About Ben Yang
13 yrs R&D,Operation & Management, Startup, Business and P&R experience in semiconductor and solar industry. Strong people management and performance management skill with more than 10 yrs managing experience. Strong leadership and great team player. Excellent communication and negotiation skills, be good at push vendors to provide effective technical and supply chain support, based on double win. Strong project management experience and capability, based on result orientation Well known QE,good knowledge and experience of SPC,CIT and Cost down. Experience and skill in P&R, financing and business, based on customer satisfaction. Knowledge of finance. Key contribution to SMIC 65nm and 45nm Logic process R&D. Strong process and hardware knowledge of PVD, CVD and ECP. Strong trouble shooting skill, especially of finding root cause of hardware issue by DOE. Integration knowledge of Logic and Dram process. Well known hetero-junction Solar cell process. Limited knowledge of other modules, such as Wet, CMP, RTP, Furnace and ETCH Ph. D degree in Shanghai Jiaotong University, majored in material science. Over 40 patents and 10 papers
Listed skills include Semiconductors, Ic, Semiconductor Industry, Process Integration, and 19 others.
Ben Yang's current company
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Ben Yang work experience
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Director, Adv. Moudle Development/Td
Current副所长
CurrentGm Of Cell&Module
CurrentResponsible for 1.5 GW cell/module start-up and operation, EPC business, including technology and equipment evaluation and business negotiation, facility construction, Fab operation, team built-up, QE, supply chain, sales, OEM, PR,ESH,IT, financing and EPC business development. Facility over 400000 m2 built, EQ purchasing negotiation completed, a 200MW EPC.
Director Of Manufacturing Technology Center.
Function on process transfer and development, Module OEM management, Fab QE& ESH, PR and financing, Automation development, Fab startup. Cell technology transfer and development from US pilot line to China production line, yield improved from 30% to 95% with Avg. efficient of 20.9% by improve process, optimize hardware and control Fab mini-environment..
Assistant Director, R&D Center
Responsible for new process & tool evaluation, in-charge of operation of pilot line, manage over 50 engineers and operators. Rebuilt and manage pilot line with 5S.
Thin Film Department Manager Of R&D
Responsible for TF Dept. for metal and dielectric film deposition developing for 55nm, 45/40nm and 32/28 logic process (300 mm), directly managed 3 senior managers with 3 teams at SH and BJ sites. supervised all TD modules at BJ, partially. 32 nm process study and tool evaluation. Fixed INWE of 40nm by optimizing SMT (Stress memory technology), shorting.
Metallization Department Manager, Ltd (Logic Tech. Develop. Center)
Responsible for Metallization Dept. and DCVD Dept. for metal and dielectric film deposition developing for 45nm, 40nm and beyond logic process (300 mm), including PVD, MOCVD, ECP, HDP, SACVD, PECVD and HARP Metal group is the most stable and efficient team among all modules. Stabilize DCVD team by encouraging engineer on meeting and one to one talking. .
Principal Staff Engineer, Group Leader Of Pvd Section Of Fab1
Responsible for process maintain, trouble shooting, defect reduction and engineer management of a group within PVD section, including the process of STD Co, Ti and AL PVD, IMPTi, SIPTi, MOCVD, TiCl4 and Wsix (200 mm), leading 8 engineers. Responsible for SPC and OCAP review of metal section and report to dept. manager weekly. Co-work with PIE and TD for.
Senior Engineer/Engineer, Pvd Section, Fab1
Wsix(TEL), Co PVD(AMAT) tool set up, process qualification, trouble shooting and process maintain. Finished one CIT project, improved WSix WPH 20%. Fixed Co deposition tool yield low issue and improved yield 1.5%.
Ben Yang education
Frequently asked questions about Ben Yang
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What company does Ben Yang work for?
Ben Yang works for SiEn(QingDao) Intergrated Circuits Co.,Ltd..
What is Ben Yang's role at SiEn(QingDao) Intergrated Circuits Co.,Ltd.?
Ben Yang is listed as Director, Adv. Moudle Development and TD at SiEn(QingDao) Intergrated Circuits Co.,Ltd..
What is Ben Yang's email address?
AeroLeads has found 1 work email signal at @163.com for Ben Yang at SiEn(QingDao) Intergrated Circuits Co.,Ltd..
Where is Ben Yang based?
Ben Yang is based in Inner Mongolia, China, China while working with SiEn(QingDao) Intergrated Circuits Co.,Ltd..
What companies has Ben Yang worked for?
Ben Yang has worked for Sien(Qingdao) Intergrated Circuits Co.,Ltd., 国电投中央研究院, Inner Mongolia Clean Air Electronic Materials Inc., Silevo China, and Hanwha Solarone.
How can I contact Ben Yang?
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What schools did Ben Yang attend?
Ben Yang holds Doctor Of Philosophy (Phd), Materials Science from Shanghai Jiao Tong University.
What skills is Ben Yang known for?
Ben Yang is listed with skills including Semiconductors, Ic, Semiconductor Industry, Process Integration, Cmos, Silicon, Product Engineering, and Failure Analysis.
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