Process Engineer
Current• US Technical Lead pioneering novel electroless metal deposition process, designing laboratory experiments, and planning future process iterations to achieve bottom-up filling of nanoscale via interconnects• Accomplished reduction of sidewall plating speed by over 50% while maintaining bottom-up performance without defects• Utilized scanning electron microscope to characterize the morphology and defects in the deposited metal layer for over 2000 chemical iterations for future process generations. • Collaborated cross-functionally between R&D, metrology, marketing, and sales to develop roadmap for future technology platforms • Tripled the efficiency of screening new additives and bulk chemistries by serving as liaison, coordinating and auditing the chemical supplier• Facilitated communication with the customer and help prioritize action items during progress meetings to the Japanese process team members • Increased tool availability by 25% through detailed data analysis and maximizing efficiency of tool downtime
