Beth Keser, Ph.D. Email & Phone Number

BETH KESER, Ph.D. is a recognized global leader in the semiconductor packaging industry with over 25 years of experience. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 49 US patents and patents pending and over 50 publications in the semiconductor industry.For over 7 years, Beth led the Fan-Out and Fan-In Wafer Level Packaging Technology Development and NPI Group at Qualcomm where she and her team qualified over 50 products resulting in over 10 billion units shipped--technology consumers around the world enjoy in mobile phones. Following that, Beth led Intel's worldwide Packaging & Systems Technology department for 7 years. Beth is currently VP of Manufacturing Technology at Zero ASIC.Beth is also an IEEE Fellow and IEEE EPS Distinguished Lecturer who chaired IEEE EPS’s 2015 ECTC. Based in San Diego, Beth was the President of the International Microelectronics Assembly and Packaging Society (IMAPS) from 2021-2023 and is currently Past President. Beth has published two edited volumes: "Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Applications Spaces" (Wiley, 2021) and "Advances in Embedded and Fan-Out Wafer Level Packaging Technologies" (Wiley, 2019). In 2021, Beth received the IEEE EPS Exceptional Technical Achievement Award for contributions in the field of Fan-Out Wafer Level Packaging. Finally, Beth has lectured at Cornell University, Georgia Tech, UCLA, Purdue, Hong Kong University of Science and Technology, Florida International University, Portland State University, and the Department of Commerce's Bureau of Industry and Security (BIS) and given keynotes and participated in panels at prominent electronic packaging and semiconductor conferences worldwide. Currently, Beth teaches professional development courses at IMAPS conferences and online at IMAPS Academy (imaps.org).

Listed skills include Semiconductors, R&D, Design Of Experiments, Packaging, and 33 others.