Principal Investigator of additive manufacturing of electronics.Leading an agency-wide packaging community of practice.Performed electronics packaging tasks on Laser Comm Relay Demonstration (LCRD) and led vibration tests on LCRD Modem.Assisted in integration and test for Cloud Aerosol Transport System (CATS-ISS).Conducted failure analysis on electronic components.Participated in lead free control plan development.Designed, planned and conducted thermal and tensile test on electronic parts.

Master of Science Thesis: Harmonic Vibration Testing of Electronic Components Attached to Printed Wiring Boards with SAC305 and Eutectic SnPb SolderAdvisory committee:Prof. Donald Barker (Chair)Professor Peter SandbornDr. Michael OstermanABSTRACTAs lead-free solders are used more frequently in electronic products, it is important to understand how they compare to conventional PbSn solders that companies are used to using. The purpose of this work is to give detailed testing results which will provide guidance to users who have to make the switch to lead-free solders.Ball grid arrays attached to printed wiring boards with conventional tin-lead (PbSn) solder (63/37) and one of the leading lead-free tin-silver-copper solders (SAC 305) were tested at high and low load levels of harmonic vibration. Leadless chip resistors attached to printed wiring boards with conventional PbSn solder (63/37) and lead-free solders (tin-silver-copper, SAC105 and SAC305, and tin-nickel-copper, SN100C) were tested at a low level of harmonic vibration. The boards were tested near their natural frequency to accelerate testing and to generate high cycle fatigue failures in a reasonable amount of time. The results of this testing showed that there are nearly negligible differences in the high cycle fatigue life between the PbSn and SAC305 solders while SN100C and SAC105 were less durable. The SAC305 vibration data and PbSn vibration data were also added to previous four-point bend and drop test data of SAC305 and PbSn solders to confirm the nearly-negligible difference between the two.

• Solved design and manufacturing issues of Zumwalt Class Destroyer Shelters.• Defined design criteria of flight simulator shelters for Rockwell Collins.

• Conducted payload and structural analysis on Electronic Modular Enclosure (EME) shelters for the Zumwalt Class Destroyer.• Modeled electronic equipment used in EME shelter assemblies.

• Designed equipment racks and conducted payload analysis for Ground Control Station designs.• Developed rework solutions for electronic housing defects on unmanned aerial vehicles to achieve quality assurance.